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Details
Inventors: Lowrey, Tyler; Ovshinsky, Stanford R.; Wicker, Guy C.; Klersy, Patrick J.; Pashmakov, Boil; Czubatyj, Wolodymyr; Kostylev, Sergey A.;
Assignee: Ovonyx, Inc. (Rochester Hills, MI)
Primary Examiner: Cao; Phat X.
Assistant Examiner:
Attorney, Agent or Firm: Schlazer; Philip H., Siskind; Marvin S.

A memory element comprising a volume of phase change memory material; and first and second contact for supplying an electrical signal to the memory material, wherein the first contact comprises a conductive sidewall spacer. Alternately, the first contact may comprise a contact layer having an edge adjacent to the memory material.

DETAILED DESCRIPTION An object of the present invention is to provide a memory element having reduced programming energy.
Another object of the present invention is to provide a memory array having reduced cell area.
These and other objects of the invention are satisfied by an electrically programmable, single-cell memory element, comprising: a volume of phase-change memory material; and a first and a second contact for supplying an electrical signal to the memory material, the first contact comprising a conductive sidewall spacer.
These and other objects of the invention are satisfied by an electrically operated memory element, comprising: a volume of phase-change memory material; and a first and a second contact for supplying an electrical signal to the memory material, the first contact comprising a contact layer having an edge adjacent to the volume of memory material.
These and other objects of the invention are satisfied by a method of fabricating an electrically operated memory array having a cell area less than 8F2, the method comprising three or less masking steps in addition to the number of masking steps used for a CMOS process flow.
These and other objects of the invention are satisfied by a method of fabricating an electrically operated memory array having a cell area less than 6F2, the method comprising three or less masking steps in addition to the number of masking steps used for a CMOS process flow.
These and other objects of the invention are satisfied by a method of fabricating a non-charge-measurement, electrically operated memory array, comprising three or less masking steps in addition to the number of masking steps used for a CMOS process flow.
These and other objects of the invention are satisfied by a method of fabricating a non-charge-storage, electrically operated memory array, comprising three or less masking steps in addition to the number of masking steps used for a CMOS process flow.



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