Large array MMIC feedthrough

DETAILED DESCRIPTION What we claim as our invention is: 1.
A backplate apparatus for use with an array of monolithic microwave integrated circuits, comprising: a plurality of electrically insulating material layers secured together, each having conductive vias extending therethrough at locations corresponding to preselected electrical signal transfer points for circuitry on at least one of said monolithic microwave integrated circuits and each having an electrical interconnection circuit deposited thereon for connection to different selected ones of said conductive vias so as to transfer signals therewith; at least one of said electrical interconnection circuits deposited on one insulating layer comprising a power divider for physically connecting a single RF transfer line to a plurality of selected ones of said conductive vias corresponding to a plurality of physical RF transfer contacts for said monolithic microwave integrated circuit; and at least one of said electrical interconnection circuits deposited on an adjacent insulating layer comprising a ground plane for said power divider.
2.
A monolithic microwave integrated circuit array and backplate apparatus comprising: a multi-layer interface board comprising multiple layers of electrically insulating material, each having a predetermined thickness and a unique interconnection circuit deposited thereon; at least one first conductive via positioned across and extending through each insulating layer, each said via being electrically connected to one interconnection circuit; a monolithic microwave integrated circuit module comprising a generally planar substrate having opposing first and second generally planar surfaces with a desired monolithic microwave integrated circuit formed adjacent said first surface; second conductive vias extending through said substrate between said first and second surfaces at locations corresponding to, and in alignment with, desired signal contact points for said monolithic microwave integrated circuit; and joining means connected between said substrate second surface and said interface board for holding said substrate on said interface board with said first conductive vias in alignment and physical contact with corresponding ones of said second conductive vias, so as to provide signal transfer paths between said unique interconnection circuits and preselected ones of said circuit signal contacts