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| Gadolinium doped germanium |
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Method of making radiation emitter devices
| Details |
Inventors: Roberts, John K.; Reese, Spencer D.;
Assignee: Gentex Corporation (Zeeland, MI)
Primary Examiner: Flynn; Nathan J.
Assistant Examiner: Andujar; Leonardo
Attorney, Agent or Firm: Price, Heneveld, Cooper, DeWitt & Litton, LLP
A radiation emitting device of the present invention includes at least one radiation emitter, first and second electrical leads electrically coupled to the radiation emitter, and an integral encapsulant configured to encapsulate the radiation emitter and a portion of the first and second electrical leads. The encapsulant has at least a first zone and a second zone, where the second zone exhibits at least one different characteristic from the first zone. Such different characteristics may be a physical, structural, and/or compositional characteristic. Preferably, the at least one different characteristic includes at least one of the following: mechanical strength, thermal conductivity, thermal capacity, coefficient of thermal expansion, specific heat, oxygen and moisture impermeability, adhesion, and transmittance with respect to radiation emitted from the radiation emitter. The radiation emitter may be in a form of an emitter, and is preferably an LED. |
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DETAILED DESCRIPTION Accordingly, it is an aspect of the present invention to provide a radiation emitter device that overcomes the above-noted problems and that provides improved performance and less vulnerability to fatal damage.
According to one embodiment of the present invention, a radiation emitting device comprises at least one radiation emitter, first and second electrical leads electrically coupled to the radiation emitter, and an integral encapsulant configured to encapsulate the radiation emitter and a portion of the first and second electrical leads.
The encapsulant has at least a first zone and a second zone.
The second zone exhibits at least one different characteristic from the first zone.
The different characteristic may be a physical, structural, and/or compositional characteristic.
For example, the at least one different characteristic may include at least one or more of the following: mechanical strength, thermal conductivity, thermal capacity, specific heat, coefficient of thermal expansion, adhesion, oxygen impermeability, moisture impermeability, and transmittance for radiation emitted from the radiation emitter.
A method of making a radiation emitting device according to the present invention comprises the steps of (1) attaching and electrically coupling at least one radiation emitter to a lead frame to form a subassembly; (2) inserting the subassembly into a mold cavity; (3) partially filling the mold cavity with a first encapsulant material; (4) filling the remainder of the mold cavity with a second encapsulant material; and (5) removing the encapsulated subassembly from the mold cavity.
For a wide range of otherwise-conventional discrete opto-electronic emitters, the present invention accomplishes a significant increase in the reliable package power capacity and accomplishes significant reductions in the package thermal resistance and package damage susceptibility in novel ways.
These and other features, advantages, and objects of the present invention will be further understood and appreciated by those skilled in the art by reference to the following specification, claims, and appended drawings
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Active Solid-state 
