Hybrid integrated circuit device having burn-in testing means
Accordingly, an object of the present invention is to provide a hybrid integrated circuit device which enables a burn-in procedure to be conducted on a power MOS-FET effectively and efficiently, and w... Read More
Inventors: Kawakami, Takayoshi;, Assignee: Mitsubishi Denki Kubushiki Kaisha (Tokyo, JP) |
Process for the formation of a flux of atoms and its use in an atomic beam epitaxy process
We claim: 1. Process for the formation of a flux of atoms of an element, comprising the steps of: forming a target constituted by a compound of said element; irradiating said target by means of a puls... Read More
Inventors: Bensoussan, Marcel; Moison, Jean-Marie M.;, Assignee: |
Method of making photoelectric conversion device
It is therefore an object of the present invention to provide a novel photoelectric conversion device which is free from the abovesaid defects of the prior art. Another object of the present invention... Read More
Inventors: Yamazaki, Shunpei;, Assignee: Semiconductor Energy Laboratory Co., Ltd. (Tokyo, JP) |
Edge emitting, light-emitting diode
This invention relates to a new structure for a high efficiency edge-emitting LED in which the optical radiation produced in an active layer of the device leaves the device without being substantially... Read More
Inventors: Scholl, Frederick W.; Anderson, Stephen J.; Coden, Michael H.;, Assignee: Codenoll Technology (Yonkers, NY) |
Process of forming yellow photographic images
What is claimed is: 1. A method for forming dye images comprising exposing and processing a silver halide photographic emulsion with an aromatic primary amino developing agent in the presence of a yel... Read More
Inventors: Arai, Atsuaki; Oishi, Yasushi; Nakazyo, Kiyoshi; Sugizaki, Atsushi; Okumura, Akio;, Assignee: Fuji Photo Film Co., Ltd. (Minami-ashigara, JP) |
Field effect semiconductor device
An object of the present invention is to provide a field effect semiconductor device having a compound semiconductor substrate and a Schottky gate of one or more silicides containing one or more refra... Read More
Inventors: Fukuta, Masumi;, Assignee: Fujitsu Limited (Kawasaki, JP) |
Stable hydrogen peroxide gels
We claim: 1. A gel stable at temperatures below about 50.degree. F. comprising, based on a total of 100 parts by weight, (a) from about 5 parts to about 20 parts of hydrogen peroxide, (b) from about 2... Read More
Inventors: Blank, Robert G.; Mody, Dhiraj S.;, Assignee: American Home Products Corporation (New York, NY) |
Composite monolithic low-loss superconductor for power transmission line
What I claim as new and desire to secure by Letters Patent of the United States is: 1. A composite superconductive tape having: (a) a rectangular central matrix element having a pair of wider faces an... Read More
Inventors: Adam, Erik;, Assignee: Airco, Inc. (Montvale, NJ) |
Process for forming ambient temperature superconducting filaments
OF INVENTION If a DC voltage V volts is applied across the ends of a conducting material of uniform length L centimeters and cross-sectional area A square centimeters in an ambient temperature enviro... Read More
Inventors: Bourgoin, Ronald C.;, Assignee: |
Process for forming improved superconductor/semiconductor junction structures
The general purpose of this invention is to provide a new and improved process for forming a superconductor/semiconductor junction structure and the new and improved structures formed by such a proces... Read More
Inventors: Roth, John A.; Roth, Lynette B.;, Assignee: Hughes Aircraft Company (El Segundo, CA) |
Method for making Josephson junctions with contamination-free interfaces utilizing a ZnO contact insulator
Therefore it is an object to provide a method of fabricating Josephson junctions that produces contamination free interfaces. It is a further object to provide a method of fabricating Josephson juncti... Read More
Inventors: Cukauskas, Edward J.;, Assignee: The United States of America as represented by the Secretary of the Navy (Washington, DC) |
Microbridge superconducting device having support with stepped parallel surfaces
What is claimed is: 1. A microbridge superconductive device comprising an electrically insulating support having first and second generally parallel surfaces which are separated by a generally perpend... Read More
Inventors: de Lozanne, Alejandro L.;, Assignee: The Board of Trustees of the Leland Stanford Junior University (Palo Alto, CA) |
Improved superconductor/semiconductor junction structures
The general purpose of this invention is to provide a new and improved process for forming a superconductor/semiconductor junction structure and the new and improved structures formed by such a proces... Read More
Inventors: Roth, John A.; Roth, Lynette B.;, Assignee: Hughes Aircraft Company (El Segundo, CA) |
Method for manufacturing an active matrix display screen with storage capacitors
The object of the present invention is to reduce this complexity and seeks more particularly to rediscover the simplicity of the two level masking method. This objective is attained via a method which... Read More
Inventors: Morin, Francois; Contellec, Michel Le;, Assignee: France Telecom Etablissement Autonome de Droit Public(Centre National (Issy les Moulineaux, FR) |
Imidazole derivative
OF THE INVENTION The present invention provides imidazole derivatives of the general formula (I): ##STR2## wherein Y is a carboxyl group, an alkoxycarbonyl group, a cyano group, a hydroxymethyl group... Read More
Inventors: Iizuka, Kinji; Akahane, Kenji; Momose, Denichi; Kamijo, Yukio; Ajisawa, Yukiyoshi;, Assignee: Kissei Pharmaceutical Co., Ltd. (Matsumoto, JP); Ono Pharmaceutical Co., Ltd. (Osaka, JP) |
Zero static power programmable logic cell
The present invention provides a zero static power circuit that operates without I.sub.cc leakage in the following stage when the control nodes are set to V.sub.cc or ground, and has a decreased switc... Read More
Inventors: Shimanek, Schuyler E.;, Assignee: Philips Electronic North America Corp. (New York, NY) |
Semiconductor memory
The principal object of this invention is to enhance the performance of a dynamic RAM which is constructed of one-element type memory cells, owing to a specific combination between the structure of a ... Read More
Inventors: Shimohigashi, Katsuhiro; Masuda, Hiroo; Ikuzaki, Kunihiko; Kawamoto, Hiroshi;, Assignee: Hitachi, Ltd. (Tokyo, JP) |
MOS-Image sensor
An object of the invention is to improve image sensors. Another object of the invention is to avoid the aforementioned disadvantages. Still another object of the invention is to provide an image senso... Read More
Inventors: Sakane, Toshio; Tsunekawa, Tokuichi;, Assignee: Canon Kabushiki Kaisha (Tokyo, JP) |
Electronic matrix array devices and systems incorporating such devices
According to one aspect of the present invention, there is provided an electronic matrix array device as described in the opening paragraph which further includes respective address circuits for the s... Read More
Inventors: Bird, Neil C.;, Assignee: U.S. Philips Corporation (New York, NY) |
Method of manufacturing a field effect transistor device having a multilayer gate electrode
It is an object of the present invention to provide a semiconductor device having a sufficient gate withstanding voltage and an excellent operation characteristic in a high frequency range and to prov... Read More
Inventors: Ishii, Tetsuo;, Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP) |
Dual ended folded bit line arrangement and addressing scheme
The present invention relates to improved layout and operating schemes for integrated circuit dynamic random access memories. In the design of sense amplifiers for dynamic random access memories (DRAM... Read More
Inventors: Shah, Ashwin H.; Womack, Richard H.; Wang, Chu-Ping;, Assignee: Texas Instruments Incorporated (Dallas, TX) |
Thin film transistor substrate, liquid crystal display panel and liquid crystal display equipment
We claim: 1. A thin film transistor substrate at least having a plurality of gate terminals disposed on an insulative substrate, a plurality of gate bus-lines electrically connected therewith, a plura... Read More
Inventors: Yamamoto, Hideaki; Matsumaru, Haruo; Tanaka, Yasuo; Tsutsui, Ken; Tsukada, Toshihisa; Shirahashi, Kazuo; Sasano, Akira; Matsukawa, Yuka;, Assignee: Hitachi, Ltd. (Tokyo, JP) |
Solid-state MIC oscillator
What is claimed is: 1. A solid-state MIC (microwave integrated circuit) oscillator fabricated in the form of a planar transmission circuit and comprising: a solid-state oscillation device; a transmiss... Read More
Inventors: Uwano, Tomoki;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Packaging for molded carriers of integrated circuits
It is an object of the present invention to provide means for packaging a plurality of carrier assemblies each having an integrated circuit which has been bonded to the electrical leads within a TAB t... Read More
Inventors: Kruppa, Victor D.;, Assignee: Delco Electronics Corporation (Kokomo, IN) |
Process of mounting tape automated bonded semiconductor chip on printed circuit board through bumps
It is therefore an important object of the present invention to provide a mounting technology which is economical and reliable. To accomplish the object, the present invention proposes to connect cond... Read More
Inventors: Urushima, Michitaka;, Assignee: NEC Corporation (JP) |
Method of producing a frame made of connected semiconductor die mounting substrates
OF PREFERRED EMBODIMENT OF THE PRESENT INVENTION The method of producing a frame made of connected semiconductor die mounting substrates (hereinafter called"connected semiconductor die mounting subst... Read More
Inventors: Nakashima, Takashi; Takai, Keiji; Tateishi, Kouji;, Assignee: Mitsui High-tec, Inc. (Kitakyushu, JP) |
Process for manufacturing a plurality of strip lead frame semiconductor devices
OF PREFERRED EMBODIMENT OF THE PRESENT INVENTION The method for producing semiconductor devices according to one embodiment of the present invention will be explained in conjunction with the attached... Read More
Inventors: Nakashima, Takashi; Takai, Keiji; Tateishi, Kouji;, Assignee: Mitsui High-Tec, Inc. (Kitakyushu, JP) |
Thermal ball lead integrated package
To achieve the foregoing and other objectives and in accordance with purpose of the present invention, an integrated circuit assembly is disclosed herein. In a first embodiment of the present inventio... Read More
Inventors: Mostafazadeh, Shahram; Chillara, Satya; Belani, Jagdish G.;, Assignee: National Semiconductor Corporation (Santa Clara, CA) |
Method of making grid array assembly
According to the present invention, the problem of processing "bad" PCB units on a strip or processing only good units in a singles format is solved by receiving only good single units from the PCB ve... Read More
Inventors: Freyman, Bruce J.; Briar, John; Maxcy, Jack C.;, Assignee: Amkor Technology, Inc. (DE) |
Components with conductive solder mask layers
One aspect of the invention provides for making soldered assemblies components. A component according to this aspect of the invention includes a base having a non solder-wettable surface such as a die... Read More
Inventors: Beroz, Masud; Haba, Belgacem;, Assignee: Tessera, Inc. (San Jose, CA) |
Active Solid-state 
