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Oligomeric aromatic dispersing agents, method of making same, and dispersions made therefrom |
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Softening non-swelling polyurethane |
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Coating composition of an acrylic polymer, polyol and polyisocyanate crosslinking agent |
| We claim: 1. A clear coating composition which cures at ambient temperatures having a film forming ... |
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Coating composition of hydroxy functional acrylic polymer, polyol and polyisocyanate crosslinking agent |
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Polypropylene resin composition |
| What is claimed is: 1. A polypropylene resin composition consisting essentially of 50 to 90% by ... |
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Coating composition having low volatile organic content |
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Molded product of a polypropylene resin |
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Corrosion resistant coating for an iron-based part and method for applying same |
| OF THE PREFERRED EMBODIMENTS The preferred embodiments of this invention will now be described. T... |
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Adhesive resin composition
| Details |
Inventors: Hattori, Masafumi; Ikeda, Chikako; Sugimoto, Satoru; Saito, Tatsuoki; Yamada, Hitoshi; Akashige, Etsushi;
Assignee: Mitsubishi Chemical Corporation (Tokyo, JP)
Primary Examiner: Reddick; Judy M.
Assistant Examiner:
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
The invention relates to an adhesive resin composition comprising an ethylene polymer having a melting point of 70 to 132.degree. C., a density of 0.88 to 0.94% g/cm.sup.3 and a melt flow rate (MFR) of 0.05 to 50 g/10 min. and/or a modified product thereof with an unsaturated carboxylic acid or its derivative (component A); a tackifier (component B); and a block copolymer containing at least one polymer block mainly composed of a vinyl aromatic hydrocarbon and at least one polymer block mainly composed of a conjugated diene or a hydrogenated product thereof (component C). This composition is useful as an adhesives showing excellent adhesion over a wide temperature range as well as processability by film molding, sheet molding, blow molding, etc. It is available for laminates comprising various kinds of resins such as polyolefins, styrenic resins, polyesters, acrylic resins and polyamides. |
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DETAILED DESCRIPTION OF THE INVENTION (1) Ethylene polymer and modified ethylene polymer with unsaturated carboxylic acid or its derivative (Component A) (i) Ethylene polymer (Component A. sub. 1) The ethylene polymer (Component A. sub. 1) to be used in the present invention is a high pressure process polyethylene (generally abbreviated as "LDPE") which can be produced by a radical polymerization method, or a linear ethylene/. alpha. -olefin copolymer which can be produced by gas phase polymerization, solution polymerization, liquid phase slurry polymerization and the like in the presence of a catalyst such as a Ziegler catalyst comprising a titanium(Ti) compound, a Philips catalyst comprising a chromium(Cr) compound or a recently noted metallocene catalyst comprising a zirconium(Zr)-, titanium(Ti)- or hafnium(Hf) compound, a high density polyethylene (generally abbreviated as "HDPE"), a middle density polyethylene (generally abbreviated as "MDPE"), a linear low density polyethylene (generally abbreviated as "LLDPE"), a very low density polyethylene (generally abbreviated as "VLDPE"), a low crystalline ethylene/butene-1 random copolymer (generally abbreviated as "EBM") or the like. In the ethylene/. alpha. -olefin copolymer indicated above, the . alpha. -olefin to be commonly employed is an . alpha. -olefin having 3 to 20 carbon atoms and containing acyclic moiety and no cyclic moiety, such as propylene, 1-butene, 1-hexene, 4-methyl-1-pentene, 1-octene, 1-decene, 1-tetradecene and 1-octadecene, which may be used alone or as a mixture of two or more of them. The ethylene polymer (Component A. sub. 1) to be used in the present invention has a melting point (as determined by DSC) of 70. degree. to 132. degree. C. , preferably 80. degree. to 132. degree. C. , and a density (as determined according to JIS K7112) of 0. 88 to 0. 945 g/cm. sup. 3, preferably 0. 89 to 0. 94 g/cm. sup. 3. The ethylene polymer preferably has a MFR (as determined according to JIS K7210 under the conditions of No. 4 shown in Table 1 thereof) of 0
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