DETAILED DESCRIPTION The epoxy resin components useful for the purposes of this invention are those epoxy compounds containing two or more reactive epoxy groups per molecule. These epoxy compounds may be aliphatic or cycloaliphatic and monomeric or polymeric, including for example vinyl cyclohexane dioxide, 4,4-epoxycyclohexylmethyl-3,4-epoxy cyclohexane carboxylate, 3,4-epoxy-6-methylcyclohexylmethyl adipate, epoxidized vegetable oils, such as for example epoxidized soy bean oil, and the bis-epoxides of poly alkylene ether glycols, and mixtures thereof. The amines useful for the purposes of this invention may be generally described as the products of the hydroxyalkylation of primary and secondary amines and polyamines wherein all active amine hydrogens have been replaced by hydroxyalkyl groups. Methods for the preparation of these hydroxyalkylated tertiary amines are widely known in the art, and generally include processes wherein ammonia, a primary amine, a diamine or a polyamine compound which has both primary and secondary amine functionality is reacted with a sufficient amount of an olefin oxide such as ethylene oxide, propylene oxide or the like to completely replace the amine hydrogens with hydroxyalkyl groups. Examples of tertiary amines having at least two hydroxyalkyl groups on the molecule include aliphatic and aromatic amines such as N,N,N'N'-tetrahydroxyethylethylene diamine, N,N,N',N'-tetrahydroxylpropylethylenediamine, triethanolamine, N-methyldiethanolamine, N,N,N'N",N"-pentaethanoldiethylenetriamine, N,N-diethanolaniline and the like, and mixtures thereof. Tertiary amines are generally regarded in the art as cure accelerators for epoxy resins, and tertiary amines such as diazabicyclo-octane (DABCO) are widely employed in the art, with or without additional curing compounds such as anhydrides, to cure epoxy resins. It is therefore suprising and completely unexpected that the particular tertiary amines useful for the purposes of this invention would be essentially non-reactive with epoxy resins and form storage-stable compositions with particular epoxy compounds which neither cure nor thicken upon prolonged standing, even at elevated temperatures
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