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| Audio reproducing apparatus |
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| It is therefore an object of the present invention to provide an effective spike elimination ... |
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| Bias current network for IC digital-to-analog converters and the like |
| In accordance with one important aspect of the invention, there is disclosed herein a digital-to-... |
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| Electrically alterable field effect transistor amplifier configuration |
| The present invention eliminates the problem of the prior art by providing a single configuration ... |
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| Low power liquid crystal display driver circuit |
| In accordance with this invention, a low power display circuit is provided. This circuit includes ... |
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| Wire harness |
| We claim: 1. A wire harness comprising: a plurality of connecting wires with each said wire being ... |
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| Defined coverage loudspeaker horn |
| A loudspeaker horn for directing sound from a driver having a principal axis of propagation to a ... |
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Electronic module RFI/EMI shielding
| Details |
Inventors: Samarov, Victor M.; Doumani, Jr., George A.; Becker, Philip F.;
Assignee: Digital Equipment Corporation (Maynard, MA)
Primary Examiner: Envall, Jr.; Roy N.
Assistant Examiner:
Attorney, Agent or Firm: Hayes, Soloway, Hennessey & Hage
A system, i.e. method and materials for RFI/EMI shielding an electronic module in a computer or other electronic product is described. In one embodiment of the invention predetermined areas of the module, such as connectors, mounting holes, and electrically insulated portions of the cases of high heat-dissipation electronic devices of the module, are masked. Thereafter, a relatively tichk, substantially continuous, electrically insulating conformal coating, in liquid state, is applied to all exposed surfaces of the module by a suitable technique, such as dipping or spraying. The preferred coating is a polymer-resin coating of a predetermined high viscosity and may be applied unfilled or filled with an electrically-insulating, thermally-conductive solid, such as powdered metal oxide, e.g. aluminum oxide. The applied conformal coating is set or cured, and a substantially continuous electrically conductive coating is applied over the insulating coating by a suitable technique, such as spraying or plating. The conductive coating has an electrical resistivity adequate for the required level of suppression of the RFI/EMI emissions from the module. Finally, the masking is removed from the masked areas of the module. In another embodiment of the invention, the electrically insulating coating is applied as a film which is vacuum formed in place, or the film may be pre-formed to conform with the module being shielded. The electrically conductive coating is then applied as above described. |
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DETAILED DESCRIPTION Wherefore, having described our the method of the present invention, what is claimed is: 1.
The method of RFI/EMI shielding an individual module of an electronic assembly comprising the steps of: (a) applying a substantially continuous, conformal, electrically insulating material to predetermined surfaces of the module to a thickness to reliably cover protruding features of electronic components carried on the module; (b) applying a substantially continuous, electrically conductive coating over the insulating material; (c) masking predetermined surface of the module prior to applying said electrically insulating material; and, (d) removing said masking following application of said electrically conductive coating.
2.
The method of claim 1, wherein said electrically insulating material is applied to a thickness of approximately 0.
005 inch to 0.
060 inch.
3.
The method of claim 1, wherein said electrically insulating material is applied to a thickness of approximately 0.
010 inch to 0.
020 inch.
4.
The method of claim 1, wherein said electrically insulating material comprises a polymer-resin material of sufficiently high viscosity such that small spaces are bridged by the cured material and respective fillets/meniscuses are formed in corners by the material.
5.
The method of claim 1, wherein electrically insulating material is filled with an electrically insulating, thermally conductive particulate solid.
6.
The method of claim 5, wherein said particulate solid comprises a powdered metal oxide.
7.
The method of claim 6, wherein said powdered metal oxide comprises aluminum oxide.
8.
The method of claim 1, and additionally comprising the step of: electrically connecting the electrically conductive coating to ground, and electrically filtering entry and exit conductors.
9.
The method of claim 1, wherein said electrically insulating material is applied as a liquid, and is set or cured in place.
10.
The method of claim 1, wherein said electrically insulating material is applied as a film material
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