 Noise spike elimination circuit for pulse width modulators |
| It is therefore an object of the present invention to provide an effective spike elimination ... |
|
| Bias current network for IC digital-to-analog converters and the like |
| In accordance with one important aspect of the invention, there is disclosed herein a digital-to-... |
|
| Electrically alterable field effect transistor amplifier configuration |
| The present invention eliminates the problem of the prior art by providing a single configuration ... |
|
| Low power liquid crystal display driver circuit |
| In accordance with this invention, a low power display circuit is provided. This circuit includes ... |
|
| Wire harness |
| We claim: 1. A wire harness comprising: a plurality of connecting wires with each said wire being ... |
|
| Defined coverage loudspeaker horn |
| A loudspeaker horn for directing sound from a driver having a principal axis of propagation to a ... |
|
| Muffler |
| What is claimed is: 1. A muffler comprising: an upper case provided at the opposite ends with semi-... |
|
| Muffler |
| It is an object of the present invention to provide a muffler which can not only damp the ... |
|
| Bearing body for motorcycle |
| I claim: 1. In a motorcycle: a support body having a longitudinal median plane; an oscillating arm ... |
|
|
Package for push-pull semiconductor devices
| Details |
Inventors: Max, Lee B.;
Assignee: Varian Associates, Inc. (Palo Alto, CA)
Primary Examiner: James; Andrew J.
Assistant Examiner:
Attorney, Agent or Firm: Cole; Stanley Z., Stoddard; Robert K.
A semiconductor package for containing two individual devices such that they may be externally connected in a push-pull relationship. Two transistors, each having an input and output pad are formed on the same dielectric wafer, in a spaced relationship with each other and a ground plane so as to form two separate transmission line paths. The transistors are wired either in a grounded emitter or grounded base configuration. A shunt inductor is formed by a metallized strip or lead bond from the collector of one transistor to the collector of the other transistor. This inductor reduces the influence of the parasitic capacitance in the equivalent output circuit of the transistors. Since the collectors of both transistors are at the same DC level it is not necessary to include a DC blocking capacitor in series with the inductor. This increases the reliability and the reproducibility of the circuit because bonding wires necessary in prior devices to connect the blocking capacitor in series with the output inductance is not necessary. This packaging technique increases the output impedance, decreases the internal losses, and increases the bandwidth when wired as a push-pull circuit. |
|
DETAILED DESCRIPTION OF THE INVENTION Referring now to FIG.
1 the transistor package is comprised of a ceramic wafer 10 upon which discrete metallized areas or pads are plated in accordance with known metallization techniques.
These areas include a pair of input areas 12, 14.
Input terminals 16, 18 are attached to the metallized input areas 12, 14, respectively.
A pair of output areas 20, 22 are also deposited on the ceramic wafer 10.
The longitudinal axes of the pair of output areas are approximately coincident with the respective longitudinal axes of the pair of input areas 12, 14.
Output leads 24, 26 are attached to the output areas 20, 22, respectively.
A common ground plane is provided and in one embodiment is comprised of a pair of metallized ground areas 30, 32, deposited on the wafer 10, extending parallel to and on each side of the pairs of input and output areas.
While not essential to the present invention, a further metallized ground area 34 is deposited on the wafer, the area passing between the input and output areas and making electrical connection to the parallel ground areas 30 and 32.
Ground terminals 36, 38 extend parallel to and on each side of the pair of input terminals and the pair of output terminals and are affixed to the pair of ground areas 30, 32.
A bridge 40, passing over the pair of metallized output areas 20, 22, is affixed to each of the ground terminals 36, 38.
It is understood that the ground areas need not be metallized on the same wafer as the input and output pads.
The ground plane may be, for example, a metal plate spaced from and parallel to the metallized areas, or any other arrangement that will result in the creation of transmission line characteristics at the operating frequency of the device.
The metallized output area 20 further includes a portion or strip of metallized area 42 extending between the first metallized input area 12 and the output area 20.
This thin strip of metallized area extends to and forms a bridge with a second portion extending between the second input area 14 and the second output area 22
|
| Related patents |
|
|
Ear receiver
In accordance with one aspect of the present invention an apparatus is provided for positioning a transducer in close proximity to the human ear. The transducer is of ...
|
|
|
Electrical connector
I claim: 1. A distributing station for an audio device whereby the signal coming from the audio device (20) can be fed to a plurality of listening devices, such as head ...
|
|
|
Method of making a telephone headset
OF THE BEST MODE OF THE INVENTION The headset of the present invention is shown in an overview in FIGS. 1-3. A headband 100 resiliently joins a pair of earphones 300. E...
|
|
|
Super directional beamforming design and implementation
The following description will be divided into four parts. Part one will detail a method for designing and implementing fixed beam optimal filters based on the filtered ...
|
|
|
Telephone transducer with improved frequency response
It is an object of this invention, therefore, to obtain maximum sound quality from a transducer which is thin and is positioned in a very thin enclosure. This and other ...
|
|
|
Driving control device for vibration wave motor
An object of the present invention is to restore ultrasonic motor which has gone into an vibration diversion state to a normal vibration state speedily and easily ...
|
|
|
Loudspeaker structure
According to the invention, a loudspeaker comprises a motor stator providing an air gap, a voice coil, a support for supporting the voice coil in the air gap, a ...
|
|
|
Audio reproducing apparatus
In accordance with the above, the present invention is intended to prevent lack of low frequency sound to be obtained from an audio signal representing a component in a ...
|
|
|
Active headset
It is an object of the invention to provide an active headset that can cancel external noise in both the higher and lower frequency ranges. It is another object of the ...
|
|
|
Threshold gate having a variable threshold level
The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows: 1. A threshold gate circuit comprising a signal ...
|
|
|
Audio Signal Processing 
