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Passive radiator cooled electronics/heat sink housing for a powered speaker
| Details |
Inventors: Perkins, Calvin C.; Wetherbee, Terry L.; Bie, David D.;
Assignee: Mackie Designs Inc. (Woodinville, WA)
Primary Examiner: Le; Huyen
Assistant Examiner: Dabney; P.
Attorney, Agent or Firm: Christensen O'Connor Johnson Kindness PLLC
An electronics/heat sink housing used in combination with a loudspeaker or powered speaker having an enclosure, a passive radiator, and an electronics package. The electronics/heat sink housing includes a planar back plate, a top plate, two side plates, and a bottom connector plate. The housing is mounted directly onto a rear panel of the speaker enclosure over the electronics package and passive radiator of the speaker. A plurality of slots are formed within the electronics/heat sink housing, preferably along the side plates and top plate of the housing, where they are bent relative to the back plate. A plurality of larger slots also may be formed along the side plates of the housing. The total area of these slots is greater than the area of the passive radiator, so that the enclosure does not interfere with air movement and sound pressure wave propagation from the passive radiator. Air movement caused by the passive radiator serves to enhance the thermal cooling of the electronic components. Because of its efficient design, the overall depth of the speaker is minimized, enabling it to fit on a conventional bookshelf. The planar back plate may be positioned against a wall or other solid surface without a reduction in sound output. |
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DETAILED DESCRIPTION What is claimed is: 1.
An electronics/heat sink housing for a powered speaker having a speaker enclosure with a rear panel, a front panel, a pair of side panels, and a pair of end panels, a passive radiator mounted to the rear panel for propagating sound pressure waves and air movement, and electronic components to allow the speaker to audibly emit sound, said electronics/heat sink housing comprising: a substantially planar back plate, a pair of oppositely-situated side plates and a top plate forming a cover of a size and shape to fit over the electronic components and passive radiator of the powered speaker, said cover being attached to the rear panel of the speaker enclosure over the electronic components and passive radiator; and said cover defining a plurality of slots communicating between an interior face thereof adjacent to the passive radiator and the exterior thereof and of a number such that the combined open area of the slots is greater than the surface area of the passive radiator in order to allow heat and air flow created by movement of the passive radiator to exit the slots outside the cover.
2.
The electronics/heat sink housing according to claim 1, in which the cover further comprises a bottom plate, oppositely-positioned from the top plate, and connected to the back plate between the two side plates of the housing.
3.
The electronics/heat sink housing according to claim 2, wherein the bottom plate further comprises a connector panel defining at least one opening of a size and shape to receive a connector cable such that the connector cable extends parallel of the enclosure in the longitudinal direction.
4.
The electronics/heat sink housing according to claim 1, wherein the plurality of slots are positioned in corner portions between the side plates and the back plate.
5.
The electronics/heat sink housing according to claim 1, wherein the slots are positioned in a corner portion between the top plate and the back plate.
6.
The electronics/heat sink housing according to claim 1, wherein the slots are positioned in corner portions between both the top plate and the back plate, and the side plates and the back plate
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