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Apparatus and method for positioning an integrated circuit chip within a multichip module
| Details |
Inventors: Eichelberger, Charles W.;
Assignee: Integrated System Assemblies Corporation (Wobourn, MA)
Primary Examiner: Arbes; Carl J.
Assistant Examiner:
Attorney, Agent or Firm: Heslin & Rothenberg
A multichip integrated circuit package comprises a substrate having a flat upper surface to which is affixed one or more integrated circuit chips having interconnection pads. A polymer encapsulant completely surrounds the integrated circuit chips. The encapsulant is provided with a plurality of via openings therein to accommodate a layer of interconnection metallization. The metallization serves to connect various chips and chip pads with the interconnection pads disposed on the chips. In specific embodiments, the module is constructed to be repairable, have high I/O capability with optimal heat removal, have optimized speed, be capable of incorporating an assortment of components of various thicknesses and function, and be hermetically sealed with a high I/O count. Specific processing methods for each of the various module features are described herein, along with additional structural enhancements. |
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DETAILED DESCRIPTION OF THE INVENTION This description is divided into three sections.
The first is a description of the basic advanced multichip module (AMCM) structure of the subject invention.
The second is a description of the processing steps and method used to achieve the basic structure, along with a discussion of the ability of the invention to solve the problems and meet the objectives set forth initially herein.
The third section describes variations of the basic advanced multichip module structure invention and methods for fabricating those variations wherein the variations meet further objectives and solve additional problems associated with multichip module structures.
I.
Advanced Multichip Module (AMCM) Structure FIG.
1 shows a cross-section diagram of the basic structure, generally denoted 10, of the present invention.
Structure 10 includes a base plate or substrate 12.
Substrate 12 can be formed from a large variety of materials including glass, metal, ceramic, plastic, silicon, alumina, aluminum nitride, copper clad molybdenum, Kovar.
RTM.
(a Westinghouse product) and many other materials.
In a novel aspect, the base plate does not require machining of grooves or wells of any kind for placement of the integrated circuits, which is a distinct departure from all know prior art approaches.
The only requirement is that the substrate's upper surface 13 be sufficiently flat that the desired degree of planarity can be maintained.
Integrated circuit chips 14 are attached to the base plate using a thin die attach material 16, which holds the chips accurately in place during processing and which presents a low thermal impedance for heat removal from the chips through substrate 12.
The exact positioning of chips 14 is governed by features on the chips themselves and not by the accuracy of the saw cut edges of the chips.
Further, all the chips are thinned to exactly the same thickness so that the top surfaces of the chips are in a plane parallel to upper surface 13 of substrate 12.
Specifically, the chips are thinned to a thickness of between 3 and 10 mils, and in a presently preferred embodiment, to a thickness of 6 mils
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