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Data bank priority system |
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Integrated circuit device having a memory and majority logic |
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Semiconductor junction antifuse circuit
| Details |
Inventors: Cutter, Douglas J.; Beigel, Kurt D.;
Assignee: Micron Technology, Inc. (Boise, ID)
Primary Examiner: Hardy; David B.
Assistant Examiner:
Attorney, Agent or Firm: Seed and Berry LLP
An integrated semiconductor junction antifuse is formed from either adjacent regions of opposite doping types or spaced apart regions of similar doping type within a substrate. In its unblown state, the junction antifuse forms an open circuit that blocks current from flowing while in the blown state, the junction antifuse conducts current. The junction antifuse is blown by applying a breakdown voltage sufficient to overcome a semiconductor junction so that current flows across the reverse-biased semiconductor junction. As current flows across the reverse-biased junction, dopant migration forms a conductive path so that the junction antifuse no longer forms an open circuit. |
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DETAILED DESCRIPTION A junction antifuse is formed by one or more reverse-biased semiconductor junctions. In one embodiment of the invention, two n+ regions are spaced apart in a p-type substrate with a small section of the p-type substrate therebetween. Input and output conductors coupled to each of the n+ regions provide signal lines for application of electrical signals to the n+ regions. If a positive input voltage is applied to one of the n+ regions, the junction between the n+ region and the p-type substrate is reverse-biased, blocking any current from flowing. If, however, the input voltage is sufficiently high, it breaks down the reverse-biased junction, causing current flow. Continuous application of the high voltage causes continuous current flow that, in turn, causes carrier migration through the gap between the n-wells. As carriers migrate through the gap, they produce a conductive path extending between the n-wells. Once the conductive path is formed, the integrated structure no longer forms an open circuit and the junction antifuse is "blown. " Thus, the unblown junction antifuse forms an open circuit and the blown antifuse forms a conductive path. In a second embodiment of the invention, the junction antifuse is formed by adjacent n+ and p+ regions in an n-well. The n+ and p+ regions are highly doped, having an abrupt junction boundary with a relatively low breakdown voltage. The p+ region is connected to an input line and the n+ region is connected to a reference potential. If a positive voltage is applied to the n+ region, the junction between the p+ and n+ regions forms an open circuit, blocking current flow. A sufficiently high voltage to break down the reverse-biased p-n junction causes current to flow from the n+ region to the p+ region. Continuous application of the high voltage causes continuous current flow that, in turn, causes carrier migration producing a conductive path. The conductive path effectively bypasses the reverse-biased p-n junction and the junction antifuse conducts
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