Motion vector estimating apparatus
It is an object of this invention to provide an improved motion vector estimating apparatus. According to a first aspect of this invention, a motion vector estimating apparatus comprising a plurality ... Read More
Inventors: Sugiyama, Kenji;, Assignee: Victor Company of Japan, Ltd. (Yokohama, JP) |
Video signal time base compression apparatus
In consideration of the above subjects, it is an object of the invention to provide a video signal processing apparatus in which a circuit for the simple double speed and a circuit for the time base c... Read More
Inventors: Kawakami, Toshikatsu; Fujimori, Toshimitsu;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Method of producing a semiconductor device
Accordingly, it is a general object of the present invention to provide a novel and useful semiconductor device and production method thereof, in which the problems described above are eliminated. Ano... Read More
Inventors: Takikawa, Masahiko;, Assignee: Fujitsu Limited (Kawasaki, JP) |
Nonvolatile semiconductor memory having three dimension charge confinement
It is an object of this invention to provide a nonvolatile memory where charge is controllably confined in a quantum well formed by a double heterojunction. It is another object of this invention to p... Read More
Inventors: Dawson, L. Ralph; Osbourn, Gordon C.; Peercy, Paul S.; Weaver, Harry T.; Zipperian, Thomas E.;, Assignee: The United States of America as represented by the United States (Washington, DC) |
Digital video image converter
Each horizontal line of a high-resolution video image signal, input from a graphics computer or other similar source in a format having a plurality of pixels of a predetermined resolution, is subjecte... Read More
Inventors: Farley, Shal W.; McCown, William;, Assignee: Video Animation Systems, Inc. (Burbank, CA) |
Semiconductor device and power converter using same
The semiconductor device according to the present invention has a pair of main surfaces. On one main surface side, the surface of a first semiconductor region of a first conduction type is in contact ... Read More
Inventors: Mori, Mutsuhiro; Yasuda, Yasumichi; Hosoya, Hiromi;, Assignee: Hitachi, Ltd. (Tokyo, JP) |
Bidirectional transistor
It is an object of the present invention to provide a semiconductor device having greatly improved bidirectional characteristics, including a very substantial increase in the current gain factor. More... Read More
Inventors: Yagi, Hajime; Tsuyuki, Tadaharu;, Assignee: Sony Corporation (Tokyo, JA) |
Method for manufacturing a semiconductor device
We claim: 1. A method for manufacturing a semiconductor device including an etching process for selectively removing a semiconductor layer formed on a substrate, said method comprising the steps of im... Read More
Inventors: Kayanuma, Akio; Nakamura, Minoru; Asano, Katsuaki;, Assignee: Sony Corporation (Tokyo, JP) |
Polyamide containing the hexafluoroisopropylidene group and process of using to form a positive image
OF THE PREFERRED EMBODIMENTS This invention is that of a high temperature polyamide containing the hexafluoroisopropylidene group. These polyamide have the following general formula (1): ##STR2## whe... Read More
Inventors: Mueller, Werner H.; Khanna, Dinesh N.; Hupfer, Bernd;, Assignee: Hoechst Celanese Corporation (Somerville, NJ) |
Method of manufacturing semiconductor device by forming barrier metal layer between substrate and wiring layer
The foregoing object of the present invention can be attained by an improved technique for the barrier property, that is, a method of manufacturing a semiconductor device comprising the steps of: form... Read More
Inventors: Sumi, Hirofumi;, Assignee: Sony Corporation (Tokyo, JP) |
Method of manufacturing a Xmos insulated transistor
It is therefore an object of the present invention to provide a method of manufacturing a lateral insulated gate field effect transistor having sufficiently high carrier mobility, excellent switching ... Read More
Inventors: Mukai, Mikio;, Assignee: Sony Corporation (Tokyo, JP) |
Polymeric dielectric layers having low dielectric constants and improved adhesion to metal lines
The present invention provides thermally stable polymeric IMDs and ILDs having enhanced adhesiveness by introduction of an adhesive material in the IMD or ILD polymeric material. In the preferred embo... Read More
Inventors: Pasch, Nicholas F.;, Assignee: LSI Logic Corporation (Milpitas, CA) |
Video game/videographics program fabricating system and method with unit based program processing
Commercially available video game systems permit a user to select, at various points in a game, a wide range of game playing options which control the remainder of game play. For example, a user may c... Read More
Inventors: Suzuki, Toshiaki; Yamato, Satoshi; Koganezawa, Nobuhito; Ozaki, Yuichi;, Assignee: Nintendo Co., Ltd. (Kyoto, JP) |
Electronic photography system with still and motion picture modes
An object of the present invention is to provide an image pickup device which overcomes the drawbacks of the conventional technique. Another object of the invention is to provide a diaphragm control d... Read More
Inventors: Saito, Syuichiro; Okino, Tadashi;, Assignee: Canon Kabushiki Kashia (Tokyo, JP) |
Optical disc access control apparatus
OF THE PREFERRED EMBODIMENT A preferred embodiment of an optical disc recording and/or reproducing apparatus according to the present invention is explained by referring to the drawings. The optical ... Read More
Inventors: Hashimoto, Minoru;, Assignee: Sony Corporation (Tokyo, JP) |
Ion-beam etching method and an apparatus therefor
OF THE PREFERRED EMBODIMENT Hereinafter, details of an embodiment of the present invention will be described. In the specimen chamber for holding therein a specimen to be etched, a gas inlet valve fo... Read More
Inventors: Konishi, Fumiya; Kusao, Kenji; Yoshioka, Yoshiaki;, Assignee: Matsushita Electric Industrial Co., Ltd. (Kadoma, JP) |
Apparatus and method for positioning an integrated circuit chip within a multichip module
OF THE INVENTION This description is divided into three sections. The first is a description of the basic advanced multichip module (AMCM) structure of the subject invention. The second is a descript... Read More
Inventors: Eichelberger, Charles W.;, Assignee: Integrated System Assemblies Corporation (Wobourn, MA) |
Surface profile and material mapper using a driver to displace the sample in X-Y-Z directions
The present invention provides a versatile and high resolution microscopy technique that uses a heterodyne interferometer as discussed in Cho et al. article in Optics Letters, entitled "Hybrid Fiber-o... Read More
Inventors: Davis, Christopher C.; Mazzoni, David L.; Cho, Kyman;, Assignee: University of Maryland, College Park (College Park, MD) |
Method and apparatus for manufacturing known good semiconductor die
In accordance with the present invention, a method and apparatus for manufacturing known good die are provided. The method of the invention, generally stated, includes the steps of: fabricating a semi... Read More
Inventors: Farnworth, Warren; Wood, Alan;, Assignee: Micron Technology, Inc. (Boise, ID) |
Extraneous substance inspection method and apparatus
An object of the present invention is to provide an extraneous substance inspection method in which a moving range of an inspection table is halved to about two times of the diameter of a wafer to the... Read More
Inventors: Nakamura, Hisato; Watanabe, Tetsuya; Morishige, Yoshio;, Assignee: Hitachi Electronics Engineering Co., Ltd. (Tokyo, JP) |
Deep trench etch on bonded silicon wafer
A sequence of steps for carrying out the invention is shown in FIGS. 2A-2D where like reference numerals refer to corresponding elements in FIGS. 1A-1D. The invention solves a number of problems with... Read More
Inventors: Gelzinis, Peter Victor;, Assignee: Harris Corporation (Melbourne, FL) |
Integrated circuit fabrication critical dimension control using self-limiting resist etch
In a basic aspect, the present invention provides an integrated circuit fabrication critical dimension control process including the steps of: depositing at least one layer of masking material; formin... Read More
Inventors: Yang, Chih-Yuh; Bell, Scott; Xiang, Qi;, Assignee: Advanced Micro Devices (Sunnyvale, CA) |
System and method for controlling device which is present in media console and system unit of a split computer system
One embodiment of the present invention is directed to a personal computer system that includes a first housing coupled to a second housing with an electrical connector. The first housing includes a f... Read More
Inventors: Crump, deceased, Dwayne T.; Dawson, III, Marshall A.; Landry, John M.; Mohre, II, Carl L.; Norris, Duane E.; Robinson, Eric F.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Boot drive selection and hibernation file detection
The present invention allows the portable computer to boot from a predetermined list of bootable data storage devices in a computer system even if the data storage devices have been relocated during o... Read More
Inventors: Doragh, Philip H.; Hallowell, William C.;, Assignee: Compaq Computer Corporation (Houston, TX) |
Use of a cache ownership mechanism to synchronize multiple dayclocks
The present invention overcomes the problems found in the prior art by providing a method of and apparatus for synchronizing multiple dayclocks within a multiple processor system having hierarchical m... Read More
Inventors: Federici, James L.; Vartti, Kelvin S.; Malek, Robert M.; Boone, Lewis A.;, Assignee: Unisys Corporation (Blue Bell, PA) |
Integrated services digital network based facility management system
The present invention provides for a facility management system with at least four facility control devices and a means for providing direct communication between each control device and at least thre... Read More
Inventors: Ruiz, John I.;, Assignee: Johnson Service Company (Milwaukee, WI) |
System for group leader recovery in a distributed computing environment
The shortcomings of the prior art are overcome and additional advantages are provided through the provision of a recovery mechanism for a failed group leader of a group of processors of a distributed ... Read More
Inventors: Badovinatz, Peter Richard; Chandra, Tushar Deepak; Kirby, Orvalle Theodore; Pershing, Jr., John Arthur;, Assignee: International Business Machines Corporation (Armonk, NY) |
Method of multicast file distribution and synchronization
This invention presents a method that delivers arbitrary data from a single source node, known as a server, to a large number of receivers using a novel method based on the selection of an active rece... Read More
Inventors: Kumar, Brijesh;, Assignee: Glenayre Electronics, Inc. (Charlotte, NC) |
Communication method and apparatus with modification of routing path by intermediate relay apparatus
It is an object of the present invention to provide a communication method, a communication apparatus, and a communication system capable of solving the above-described problems. The invention has bee... Read More
Inventors: Sato, Hiroaki; Okazaki, Hiroshi; Suzuki, Shigeo; Fukasawa, Toshihiko;, Assignee: Canon Kabushiki Kaisha (Tokyo, JP) |
Color video and audio recording and/or reproducing apparatus
Accordingly, it is an object of the present invention to provide an apparatus, such as, a VTR, for effecting high quality recording and reproducing of both color video and audio signals. More specific... Read More
Inventors: Kawakami, Hiroshi; Narita, Takato;, Assignee: Sony Corporation (Tokyo, JP) |
CPUs 
