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 Direct-heated flow measuring apparatus

Details
Inventors: Ohta, Minoru; Miura, Kazuhiko; Onoda, Michitoshi; Iwasaki, Yukio; Hattori, Tadashi;
Assignee: Nippon Soken, Inc. (Nishio, JP)
Primary Examiner: Goldstein; Herbert
Assistant Examiner:
Attorney, Agent or Firm: Cushman, Darby & Cushman

A direct-heated flow measuring apparatus including a substrate, a film resistor for generating heat and sensing its temperature, and a feedback control circuit for controlling the heat generated by the film resistor so that the temperature of the film resistor is a predetermined value. Also, provided in the substrate is an aperture or the like for throttling the heat transfer of the film resistor. Further, a reinforced structure is formed on the part of substrate where the aperture or the like is formed.

DETAILED DESCRIPTION It is an object of the present invention to provide a strong direct-heated flow measuring apparatus and manufacturing method for the same.
According to the present invention, there is provided a direct-heated flow measuring apparatus including a substrate, a film resistor for generating heat and sensing its temperature, and a feedback control circuit for controlling the heat generated by the film resistor so that the temperature of the film resistor is a predetermined value.
Also, provided in the substrate is an aperture or the like for throttling the heat transfer of the film resistor.
Further, a reinforced structure is formed on the part of substrate where the aperture or the like is formed.
Such a reinforced structure has a minimal effect on the adiabatic effect, yet increases the mechanical strength of the heat transfer throttling portion.



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