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Network terminating terminal apparatus for integrated services digital network |
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System and method for telephone network testing |
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Anthropomorphic mammography and lung phantoms |
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Symbol reader using differentiating circuit for light beam focusing |
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Radio-diagnostic equipment with shutter |
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Flash-erase-type nonvolatile semiconductor storage device |
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Light emitting semiconductor diode
| Details |
Inventors: Mori, Mitsuhiro; Ito, Kazuhiro; Morioka, Makoto; Ono, Yuichi;
Assignee: Hitachi, Ltd. (JA)
Primary Examiner: Edlow; Martin H.
Assistant Examiner:
Attorney, Agent or Firm: Craig & Antonelli
A light emitting semiconductor diode comprises a first semiconductor region having a first conductivity type and a narrow forbidden band gap, a second semiconductor region, disposed on the first semiconductor region, having the first conductivity type and a low impurity concentration, a third semiconductor region, disposed on the second semiconductor region, having a second conductivity type which is opposite to the first conductivity type, and an ohmic contact disposed on the surface of the first semiconductor region, which is opposite to the second semiconductor region. The surface has a plurality of holes extending from the outer surface through the first semiconductor region toward a p-n junction between the second and third semiconductor regions, which holes are filled with a highly reflective metal having a high thermal conductivity. |
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DETAILED DESCRIPTION As is shown in FIG. 1, two semiconductor layers 39, 40 are formed on a semiconductor substrate 43 using conventional semiconductor technology. The first layer 39, of n conductivity type GaAs doped with Te about 1 . mu. m thick, has a high impurity concentration (5. times. 10. sup. 18 cm. sup. -. sup. 3) and a narrow forbidden band gap. The second layer 40, of Ga. sub. 0. 7 Al. sub. 0. 3 As doped with Sn about 2 . mu. m thick, has an impurity concentration (1. times. 10. sup. 18 cm. sup. -. sup. 3) lower than that of the first layer 39. The substrate 43 of Ga. sub. 1-x Al. sub. x As (x. ltoreq. 0. 3) doped with Zn about 150 . mu. m thick has an impurity concentration of 1. times. 10. sup. 18 cm. sup. -. sup. 3. The second and third layers form a p-n junction 41 therebetween. The first layer 39 has a high impurity concentration and a narrow forbidden band so that the metal electrodes disposed thereon can form good ohmic contact with the first layer. On the other hand, the second layer 40 has a low impurity concentration so that a high internal quantum efficiency can be obtained. The substrate has a crystal composition ratio x giving a forbidden band gap determined by the wavelength of the light to be obtained near the p-n junction 41. The crystal composition ratio increases with increasing distance from the p-n junction. Ring-shaped portions of layers 39 and 40 are transformed into p conductivity type by selectively diffusing zinc so as to form a high impurity concentration p conductivity type layer 38 about 5 . mu. m thick, as illustrated in FIG. 2. The remaining parts of the first and second layers having a diameter of about 160 . mu. m form the first and second semiconductor regions 46 and 42, respectively. A phosphosilicate glass film 51 having a thickness of between 4000 and 6000 A is desposited on the first region 46 and the high impurity concentration p conductivity type layer 38. A number of perforations are formed in the central part of the phosphosilicate glass film 51 on the first region 46 by well-known photolithographic techniques
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