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Method of producing a tag device with IC capacitively coupled to antenna
| Details |
Inventors: Hiroyuki, Noto;
Assignee: Oki Electric Industry Co., Ltd. (Tokyo, JP)
Primary Examiner: Mayes; Curtis
Assistant Examiner:
Attorney, Agent or Firm: Jones Volentine, LLP
A tag device and a method of producing it are disclosed. The tag device has an IC (Integrated Circuit) device, electrode plates included in the IC device, an electrically insulating film covering the electrode plates, antenna terminals each facing one of the electrode plates with the intermediary of an electrically insulating film, antennas each being connected to one of the antenna terminals, and packings. The tag device is highly durable and reliable and can be produced by a simple procedure. |
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DETAILED DESCRIPTION It is therefore an object of the present invention to provide a tag device substantially free from faults ascribable to defective connection and highly durable and reliable.
It is another object of the present invention to provide a method of producing a tag device and including a minimum of complicated procedure.
In accordance with the present invention, in a tag device having a generally flat IC device including a response circuit for storing information and for outputting a signal based on the information, and an antenna, a generally flat electrode plate is positioned on a major surface of the IC device and connected to the response circuit.
A generally flat antenna terminal is connected to the antenna and faces the electrode plate at a preselected distance.
Also, in accordance with the present invention, a method of producing a tag device includes the step of forming a generally flat antenna terminal on a first packing.
An IC device is prepared which includes a response circuit for storing information and for outputting a signal based on the information, a generally flat electrode plate, and an electrically insulating film covering the electrode plate.
The IC device is placed on the antenna terminal such that the antenna terminal and electrode plate face each other.
A second packing is placed on the IC device.
Finally, the first and second packings are adhered to each other.
Also, in accordance with the present invention, a method of producing a tag device includes the step of forming a generally flat antenna terminal on a first packing.
A dielectric layer is formed on the antenna terminal.
An IC device is prepared which includes a response circuit for storing information and for outputting a signal based on the information, a generally flat electrode plate, and an electrically insulating film covering the electrode plate.
The IC device is placed on the dielectric layer such that the antenna terminal and electrode plate face each other.
A second packing is placed on the IC device
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