Sensor for monitoring an article

DETAILED DESCRIPTION In one form of the invention, a sensor is provided for attachment to an article to be monitored.
The sensor has a substrate with a first surface having a substantial area, a conductive trace defining a conductive path on the substrate between first and second locations, and an adhesive on the first surface for adhering the sensor to an object to be monitored in an operative state.
A weakening is provided in the substrate to cause separating/tearing of the substrate in a predetermined fashion as an incident of a force being applied to the substrate with the sensor in the operative state tending to peel the sensor off of the object to be monitored.
The conductive trace is arranged on the substrate so that as the substrate separates/tears in the predetermined fashion, the conductive path defined by the conductor trace is interrupted.
The adhesive may be applied over the conductive trace.
In one form, the weakening includes one of a U-shaped cut and a V-shaped cut at least partially through the substrate.
The substrate may have a connecting portion to be operatively engaged with a monitoring system for the sensor, with the first and second locations being on the connecting portion.
The weakening may include first and second spaced weakening cuts at least partially through the substrate.
In one form, the substrate has a frangible portion between the first and second weakening cuts so that the substrate separates/tears along the first and second cuts as an incident of the force being applied to the substrate tending to peel the substrate off an object to be monitored and tears the frangible portion between the first and second cuts.
The first and second cuts may be configured and spaced so that with the substrate separated/torn along the first and second cuts and the frangible portion of the substrate torn, a discrete portion of the substrate separates from the remainder of the substrate.
The adhesive may be provided on the discrete portion of the substrate so that the discrete portion of the substrate remains adhered to the object to be monitored, with the remainder of the substrate separated from the object