Universal alarm system |
| OF THE PREFERRED EMBODIMENT Referring now to the figures in which like numerals indicate like ... |
|
Magnetic field position and orientation measurement system with dynamic eddy current rejection |
| The present invention relates to embodiments of a magnetic field position and orientation ... |
|
System and method for applying an animal access door to an inclined surface |
| The present invention is a system and method for applying an animal access port to an inclined ... |
|
Mechanism for extending and retracting swimming pool covers |
| The pool-covering apparatus of this invention includes a bracket-support member in which a ... |
|
Hybrid motion tracker |
| Accordingly, it is an object of the present invention to provide a unique and enhanced technique ... |
|
Security system and portable device usable therein |
| One aspect of the present invention is a security system for use with a locked subject having a ... |
|
Pickupless magnetostrictive position measurement apparatus |
| What is claimed is: 1. A magnetostrictive position measurement apparatus comprising: a circuit ... |
|
Magnetic field permeable barrier for magnetic position measurement system |
| The present invention relates to embodiments of a magnetic field position and orientation ... |
|
|
Method of making IC card
| Details |
Inventors: Ochi, Katsunori; Takemura, Seiji; Kodai, Syojiro; Kurisu, Tuguo;
Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP)
Primary Examiner: Vo; Peter
Assistant Examiner:
Attorney, Agent or Firm: Leydig, Voit & Mayer, Ltd.
A method of producing a thin IC card having a built-in battery includes forming a through-hole including an edge in a circuit board having obverse and reverse main surfaces, a circuit pattern being present on a first of the main surfaces of the circuit board; mounting a functional part on the first of the main surfaces of the circuit board; molding said circuit board and said functional part in a resin with a second main surface of said circuit exposed and forming a battery lodging section in the resin molding defined by the through-hole; and mounting a battery in said battery lodging section and electrically connecting the circuit pattern to the battery. |
|
DETAILED DESCRIPTION This invention has been made with a view toward solving the above problems. It is an object of this invention to provide a thin IC card with flat surfaces and a production method for the same which allow the battery to be easily mounted in the card without being damaged. In order to achieve the above object, there is provided, in accordance with this invention, a thin IC card having a built-in battery, the IC card comprising: a circuit board having obverse and reverse main surfaces on one of which a functional part is mounted, and a through-hole portion constituting an edge around a lodging section in which the battery is lodged, a circuit pattern being formed at least on that main surface of the circuit board on which the functional part is mounted; a molding-resin section formed as a card in such a way that the circuit board and the functional part are embedded therein, exposing that main surface of the circuit board on which the functional part is not mounted, the lodging section in which the battery is lodged being formed in the molding-resin section in such a way that the through-hole portion of the circuit board constitutes an inlet of the lodging section; and battery connection means for firmly supporting the battery in the lodging section and for electrically connecting the battery to the circuit pattern on the circuit board. In this invention the battery connection means electrically connects the circuit pattern on the circuit board to the battery through a recess or a cutout on the circuit board. In another embodiment of this invention, the section between the battery and the lodging section is filled with an expandable resin, which forms a flat surface together with the circuit board surface. In still another embodiment of this invention, a decorative sheet is disposed on that main surface of the circuit board on which the functional part is not mounted, the molding-resin section being formed in such a way that the circuit board, on which the functional part is mounted, and the decorative sheet are embedded in such a way that one side of the decorative sheet is exposed, with the exposed main surface of the decorative sheet and the molding-resin section forming one flat surface
|
|