Process for manufacturing printed substrates and decalcomania compositions used therefor

DETAILED DESCRIPTION What is claimed is: 1.
A process for manufacturing a printed substrate comprising the steps of: providing a decalcomania composition consisting of a permeable backing paper, a water-soluble binder coated thereon, a printed electric circuit pattern made of a conductor material or resistor material formed on the binder, and a removable cover coat formed on the printed pattern, the removable cover coat consisting essentially of a member selected from the group of (1) silicone rubber, (2) a plastic film containing silicon rubber and (3) a film-forming coating material containing silicon rubber, immersing said decalcomania composition in water to separate the paper from said printed conductor or resistor material-made pattern attached to the cover coat, applying said printed pattern which is attached to the cover coat directly onto a flat or non-flat substrate substantially without any material between said printed pattern and said substrate, said substrate being of low porosity selected from the group consisting of alumina or fosterite, peeling said cover coat off said printed pattern applied to the substrate, and baking the printed pattern-applied substrate to obtain a conductor or resistor material pattern printed substrate, whereby the conductor or resistor pattern is baked substantially free of any material thereon which would have a deleterious effect on the performance of the resulting printed electric circuit.
2.
A process according to claim 1, wherein the plastic film or film-forming coating material contains silicone rubber in amounts by weight of from 0.
5 to 15%.
3.
A process according to claim 1 wherein said pattern is made of a conductor material, and further repeating said steps using a pattern of a resistor material to thereby apply the resistor pattern material to the conductor pattern material to thereby obtain an electric circuit printed substrate.
4.
A process according to claim 3 wherein the baking of the conductor and resistor material patterns is effected at the same time after they have been applied to the substrate