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| Selectable chip carrier |
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| Mounting structure for an integrated circuit |
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Laminated electronic package including a power/ground assembly
| Details |
Inventors: Kresge, John S.; Light, David N.; Wu, Tien Y.;
Assignee: International Business Machines Corporation (Armonk, NY)
Primary Examiner: Sparks; Donald A.
Assistant Examiner:
Attorney, Agent or Firm: Calfee, Halter & Griswold
A power/ground structure and associated circuit card or board are provided in which the coefficient of thermal expansion of the power/ground structure and associated circuit board are closely matched to each other. The circuit board or card is formed of organic electrically-insulating material having electrical circuitry thereon which carries an integrated circuit chip. The power/ground assembly is formed of alternating layers of organic insulating material and at least two layers of electrically-conducting material, typically copper, one of the layers of electrically-conducting material forming a power connection and another layer of the electrically-conducting material forming a ground plane. There is also at least one additional layer of a structural material having a relatively high Young's Modulus and a CTE of less than about 10 PPM/.degree.C. Invar or copper clad Invar are preferred materials for this structure. The electrically-conducting copper material and the Invar are selected in thickness and number such that, together with the electrically-insulating material, the composite CTE of the power/ground structure closely matches that of the circuit card or board. |
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DETAILED DESCRIPTION According to the present invention, a power/ground structure and associated circuit card or board and method of manufacturing the same are provided.
The card or board is formed of organic electrically insulating material having opposed, spaced faces.
Electrical circuitry including chip or chip carrier mounting sites is provided on one face of the circuit board or card, and electrical connection sites are provided on the other face to provide power and ground connections to the circuit board or card, and which, through vias or plated through holes in the circuit board or card, in turn provide power and ground to the chip carrier or chips.
The CTEs of the board or card and power/ground structure are controlled to given known values.
The power/ground assembly is formed of alternating layers of organic insulating material and at least two layers of electrically-conducting material (typically copper), one of the layers of electrical conducting material forming a power supply connection, and another layer of electrical conducting material forming a ground plane connection, and at least one layer of structural material having a relatively high Young's Modulus and a CTE of less than about 10 ppm/.
degree.
C.
Nickel iron alloys having nominally 36% nickel are well suited for this, as is molybdenum.
Invar.
RTM.
is a preferred material for this which can be a sheet of Invar.
RTM.
or a laminate of copper-Invar-copper (CIC) layers.
Invar.
RTM.
is a nickel iron alloy containing about 36% nickel, 63% iron and up to 1% of other metals.
The power/ground assembly has a mounting surface defined by the exposed face of one of the layers of the organic insulating material, which has formed thereon power connection sites and ground connection sites.
A number of vias or plated holes extend from the power connection sites on the mounting face to the layer of electrically-conducting material defining the power supply and another number of vias or plated holes extend from the ground connection sites on the mounting face to the conducting material defining the ground plane
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Control Computers 
