Method of processing a semiconductor device

DETAILED DESCRIPTION Alignment of a substrate handier to an electrostatic chuck is accomplished using an alignment tool and an alignment pin to align a reference point on the electrostatic chuck directly to a reference point on the substrate handler.
Placement of a substrate into a processing chamber is accomplished using the substrate handler to place the substrate accurately on the electrostatic chuck.
The substrate is then processed in the processing chamber using the electrostatic chuck.
FIG.
3 includes a perspective view of an alignment tool 30 that can be used with an Applied Materials 5200 Centura.
TM.
platform, which has an electrostatic chuck (not shown) requiring very tight alignment tolerances.
In one particular case, tolerances should be maintained within approximately 1.
3 mm (0.
05 inches) of the specified dimensions.
The alignment tool 30 includes a plastic annular ring 32 to prevent the alignment tool 30 from scratching the electrostatic chuck 53.
The annular ring 32 has an inner beveled edge 322 that allows it to fit snugly against a portion of the electrostatic chuck that does not contact the substrate (not shown) during processing.
This allows the alignment to occur without damaging the substrate contacting surface of the electrostatic chuck.
In one particular embodiment of the present invention, three pegs 324 are located along annular ring 32.
The pegs help to guide the alignment tool into corresponding recessions (not shown) near the outer edge of the electrostatic chuck.
In this particular embodiment, the electrostatic chuck is held in place with 12 bolts (not shown) that are spaced substantially equal distances apart in the recessed holes along the radius of the chuck.
The bolts are recessed within the openings to form the recessions.
Although the pegs 324 are not required, they provide a consistent point of reference for the alignment tool, allowing it to be securely placed over the electrostatic chuck, and prevent it from rotating.
A bridge 34 is attached to the annular ring 32 and extends over the electrostatic chuck