 Rapidly solidified aluminum based silicon containing, alloys for elevated temperature applications |
| We claim: 1. A rapidly solidified aluminum-base alloy consisting essentially of the formula Al.sub.... |
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| Magnetic liquid supported linear accelerometer |
| According to the invention, there is provided a linear accelerometer having a proof mass comprising ... |
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Semiconductor element module
| Details |
Inventors: Matsui, Noriyuki;
Assignee: Fujitsu Limited (Kawasaki, JP)
Primary Examiner: Ngo; Ngan V.
Assistant Examiner:
Attorney, Agent or Firm: Staas & Halsey
A semiconductor element module is adapted to be mounted on a main body by insertion in a predetermined direction. The semiconductor element module includes a substrate having first and second surfaces, one or a plurality of semiconductor elements mounted on at least one of the first and second surfaces of the substrate, at least a first row of terminals and a second row of terminals provided on at least one of the first and second surfaces of the substrate, where the first row of terminals and the second row of terminals are located at different positions along the predetermined direction, signal lines provided on at least one of the first and second surfaces of the substrate, connecting arbitrary terminals of the semiconductor elements to predetermined ones of the first row of terminals, and a mechanism, coupled to predetermined terminals of at least one of the first row of terminals and the second row of terminals, for adapting signal levels output from the semiconductor element module depending on whether the first row of terminals or the second row of terminals electrically connect to the main body. |
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DETAILED DESCRIPTION Accordingly, it is a general object of the present invention to provide a novel and useful semiconductor element device in which the problem described above is eliminated.
Another and more specific object of the present invention is to provide a semiconductor element module adapted to be mounted on a main body by insertion in a predetermined direction, comprising a substrate having first and second surfaces, one or a plurality of semiconductor elements mounted on at least one of the first and second surfaces of the substrate, at least a first row of terminals and a second row of terminals provided on at least one of the first and second surfaces of the substrate, where the first row of terminals and the second row of terminals are located at different positions along the predetermined direction, signal lines provided on at least one of the first and second surfaces of the substrate, connecting arbitrary terminals of the semiconductor elements to predetermined ones of the first row of terminals, and means, coupled to predetermined terminals of at least one of the first row of terminals and the second row of terminals, for adapting signal levels output from the semiconductor element module depending on whether the first row of terminals or the second row of terminals electrically connect to the main body.
According to the semiconductor element module of the present invention, it is possible to automatically change the signal level or automatically set the control signal to the semiconductor elements depending on whether the first row of terminals or the second row of terminals electrically connects to the main body.
It is unnecessary to change the signal arrangement even if a plurality of signal level systems exist, and a suitable signal level can be obtained from the semiconductor element module.
In other words, it is possible to maintain compatibility among the interface standards.
Still another object of the present invention is to provide the semiconductor element module described immediately above, wherein the means comprises a series resistance connected between each of the predetermined terminals out of the first row of terminals and a corresponding one of the second row of terminals
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