Semiconductor processing chamber calibration tool

DETAILED DESCRIPTION An apparatus and method for aligning the components of a semiconductor processing system is disclosed.
A calibration tool positioned on the main body of the processing chamber is used to align the coordinates of the susceptor, wafer lifting pins, susceptor shaft, wafer handling blade and the rotational axis of the susceptor with that of the main body.
By aligning the various components to a common coordinate system, it is possible to more precisely control the angular orientation of a wafer being processed with that of the processing, gas flow.
In accordance with one embodiment, the calibration tool includes a circular body having an upper surface and a lower surface.
Three protuberances, spaced 120 degrees apart, extend from the lower surface.
The distal end points of the protuberances define an x-y plane.
The calibration tool is supported on the processing chamber main body by the three protuberances.
As such, the x-y axis of the calibration tool is aligned with the x-y axis of the main body of the processing chamber.
The calibration tool also includes three spring loaded post that are spaced 120 degrees apart.
The spring loaded posts extend radially outward from the circumference of the substrate to act upon a vertical wall section of the processing chamber main body.
The spring loaded posts act to center the z axis of the calibration tool with the z axis of the processing chamber's main body.
One or more through openings are provided within the calibration tool body for receiving measuring devices that are used to measure differences between either of the x, y and z coordinates of the processing chamber main body and the various chamber components.