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Semiconductor alignment tool

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Vacuum apparatus for the surface treatment of workpieces

Details

Inventors: Galdos, Aitor; Wagner, Rudolf; Bruderer, Markus;
Assignee: Balzers Aktiengesellschaft (Furstentum, LI)
Primary Examiner: Briggs; William R.
Assistant Examiner:
Attorney, Agent or Firm: Notaro & Michalos P.C.

Vacuum processing plant with a small footprint for the surface treatment of large-area substrates in a virtually upright position, has a vacuum chamber containing a substrate carrier rotatable about a central axis and with at least one processing station mounted on its periphery. A transfer chamber is also mounted on its periphery and connects it to a load-lock chamber. A first transport mechanism moves the substrates from the transfer chamber in a radial direction in and out of the vacuum chamber, a second transport mechanism moves the substrates in a direction perpendicular to that of the first transport mechanism, between the transfer chamber and the load-lock chamber. A third transport mechanism moving in parallel with the second one doubles the transport capacity between the load-lock chamber and the transfer chamber.

DETAILED DESCRIPTION The aim of the present invention is to remedy the disadvantages of the existing technology.
In particular a vacuum processing system shall be created in such a way that it is able to handle also large-surface substrates with a higher cycle frequency combined with simple handling and a small footprint, so that a high degree of system economy is achieved.
For achieving this objective the vacuum process system features the characteristics according to claim 1.
The preferred design versions of the invention are described in the dependant claims.

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