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Home Control Computers Wafer-out-of-pocket-detector-and-susceptor-leveling-tool

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 Wafer out-of-pocket detector and susceptor leveling tool

Details
Inventors: Li, Shih-Hung; Vass, Curtis;
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Primary Examiner: Beck; Shrive
Assistant Examiner: Torres-Velazquez; Norca L.
Attorney, Agent or Firm: Blakely Sokoloff Taylor & Zafman

An apparatus and method for monitoring the level of a semiconductor processing chamber susceptor and the inclination of a wafer residing within a pocket of the susceptor. In one embodiment, a light beam transmitter is positioned to direct a light beam, such as a laser beam, onto the top surface of a wafer that has been positioned within a susceptor pocket. The light beam forms a target spot of a particular size and shape on the surface of the wafer. A camera is positioned to observe the target spot. A change in the angular orientation of the wafer or susceptor will result in a change in the size and shape of the target spot. The camera is configured to detect changes in the target spot size and shape. A logic circuit is provided at the output of the camera to correlate the observed shape and size of the target spot to a value indicative of the levelness of the susceptor and/or the inclination of a wafer located within the pocket of the susceptor. In another embodiment, the light beam is focused directly onto a surface of the susceptor. In this manner, the levelness and movement of the susceptor itself may be monitored.

DETAILED DESCRIPTION An apparatus and method for monitoring the level of a semiconductor processing chamber susceptor and the inclination of a wafer residing within a pocket of the susceptor is disclosed.
The apparatus of the present invention includes a light beam transmitter that is positioned to direct a light beam, such as a laser beam, onto the top surface of a wafer that has been positioned within a susceptor pocket.
The light beam forms a target spot of a particular size and shape on the surface of the wafer.
A CCD (charged couple diode) camera is positioned to observe the target spot.
A change in the angular orientation of the wafer or susceptor will result in a change in the size and shape of the target spot.
The CCD camera is configured to detect changes in the target spot size and shape.
A logic circuit is provided at the output of the CCD camera to correlate the observed shape and size of the target spot to a value indicative of the levelness of the susceptor and/or the inclination of a wafer located within the pocket of the susceptor.
In lieu of focusing the light beam on a wafer residing within a pocket of a susceptor, the light beam may be focused directly onto a surface of the susceptor.
In this manner the levelness and movement of the susceptor itself may be monitored.



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