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Probe test apparatus
An object of the present invention is therefore to provide a probe test apparatus for enabling the operator to more easily mount the cassette on the cassette-mounted ...
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Method for co-registering semiconductor wafers undergoing work in one or more blind process modules
The present invention contemplates a method for co-registering a semiconductor wafer undergoing work in one or more blind process modules. This method relies on the ...
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Wafer transfer system having rotational capability
OF THE INVENTION A transfer system 10 according to the present invention is shown generally in FIG. 1. In the configuration shown, a plurality of carriers 12 are held ...
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Vacuum apparatus for the surface treatment of workpieces
The aim of the present invention is to remedy the disadvantages of the existing technology. In particular a vacuum processing system shall be created in such a way that ...
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Multiple interface door for wafer storage and handling container
OF THE INVENTION The present invention is an improved design for providing multiple access ports into a sealed container or "pod" for handling (i.e., transporting, ...
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Dual cassette load lock
In accordance with the preferred embodiment of the present invention, a workpiece loading interface is presented for inclusion within a workpiece processing system. The ...
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Substrate housing and docking system
Accordingly, the present invention provides a modular, transportable housing for storing articles such as substrates, including semiconductor wafers, masks and flat ...
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Wafer position error detection and correction system
OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention detect wafer positions as wafers are transported within a semiconductor processing equipment ...
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Substrate cassette and side rail therefor
The present invention has been made in view of the foregoing disadvantages of the prior art. Accordingly, it is an object of the present invention to provide a side rail ...
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Method of processing a semiconductor device
Alignment of a substrate handier to an electrostatic chuck is accomplished using an alignment tool and an alignment pin to align a reference point on the electrostatic ...
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