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Carrier and test socket for leadless integrated circuit
What is claimed is: 1. A leadless integrated circuit carrier and test socket comprising a base, a circuit receiving cavity disposed in a central portion of said base, a ...
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IC package connector
OF A PREFERRED EMBODIMENT A detailed description of a preferred embodiment according to the present invention is now made with reference to FIGS. 1, 2, 3 and 4. As ...
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Production of semiconductor devices
We claim: 1. A method of electrically interconnecting conductors formed by first and second metal layers respectively on opposing faces of a polyimide substrate by a ...
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Method of manufacturing a card having electronic memory and a card obtained by performing said method
In order to achieve this aim, the invention makes the electronic module by means of the lead frame technique instead of the printed circuit technique. The present ...
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Retractable caster assembly
Therefore, the objective of the present invention is to provide a retractable caster assembly which can be operated conveniently and which obviates the need for removing ...
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Method for equipping a wiring backplane
It is an object of the present invention to provide a method for equipping a wiring backplane with contact blades wherein the assembly aid for the contact blades, that ...
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Circuit arrangement for multilayer printed circuit board
Therefore, an object of the present invention is to provide a circuit arrangement for a multilayer printed circuit board on which a plurality of electronic devices are ...
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Laminated electronic package including a power/ground assembly
According to the present invention, a power/ground structure and associated circuit card or board and method of manufacturing the same are provided. The card or board is ...
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Multi-layer circuit substrate having orthogonal grid ground and power planes
The present invention was made in view of the above-mentioned problems, and an object of the invention is to provide a multi-layer circuit substrate which, by ...
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Multichip module and method of forming same
The present invention provides an interconnection medium wherein the number of interconnect layers is reduced while the low inductance power distribution characteristics ...
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