Replacement chip module
OF THE INVENTION The present invention is directed to a replaceable chip module for electrically connecting one or more first circuit members to a second circuit member. The first circuit members is ... Read More
Inventors: Rathburn, James J.;, Assignee: Gryphics, Inc. (Plymouth, MN) |
Method of making an electronic interconnect device
The above and other objects, which will be apparent to those skilled in the art, are achieved by the present invention which in a first aspect relates to a method of making an electronic interconnect ... Read More
Inventors: Fasano, Benjamin V.; Prettyman, Kevin M.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Apparatus and method for printed circuit board repair
It is an object of the present invention to rework or repair a printed circuit board efficiently and at minimum cost. Accordingly, method and apparatus for efficiently repairing or reworking a printed... Read More
Inventors: Crudo, Alan Harris; Davis, John Gillette; Le Coz, Christian Robert; Pierson, Mark Vincent; Sarkhel, Amit Kumar; Trivedi, Ajit Kumar;, Assignee: International Business Machines Corporation (Armonk, NY) |
Sheet metal component for double pattern conduction and printed circuit board
A first aspect of the present invention is directed to a sheet metal component for double pattern conduction, for establishing connection between a first plane pattern and a second plane pattern provi... Read More
Inventors: Nojioka, Shinichi;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Solderable injection-molded integrated circuit substrate and method therefor
A solderable injection-molded substrate and a method for manufacturing an injection-molded substrate generate a circuit pattern within a substrate having solderable wire-bonding or solder ball attach ... Read More
Inventors: Huemoeller, Ronald Patrick; Rusli, Sukianto;, Assignee: Amkor Technology, Inc. () |
Non nesting component carrier tape
Referring now to FIGS. 1 through 4 of the drawing, there is shown a surface mount supplies carrier tape according to the present invention generally designated by the reference numeral 10. Generally ... Read More
Inventors: Skrtic, Tom; Juntunen, Timothy J.;, Assignee: Minnesota Mining and Manufacturing Company (Saint Paul, MI) |
Method of manufacturing a multilayer circuit board
The above-discussed and other problems and deficiencies of the prior art are overcome or alleviated by the methods of fabricating multilayer circuits of the present invention. In accordance with the p... Read More
Inventors: Daigle, Robert; Malbaurn, Samuel; Noddin, David;, Assignee: Rogers Corporation (Rogers, CT) |
Method of making multilayered circuit board
What is claimed is: 1. A method of making a multilayered circuit board assembly including at least two layered subassemblies each including at least one dielectric layer, electrically conductive wirin... Read More
Inventors: Chen, William T.; Gall, Thomas P.; Wilcox, James R.; Wu, Tien Y.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Au-Sn transient liquid bonding in high performance laminates
The present invention is concerned with interconnecting laminated layers within the high density PCB. In particular, as depicted in FIG. 11, the present invention is concerned with bonding the metalli... Read More
Inventors: Davis, Charles R.; Hsiao, Richard; Loomis, James R.; Park, Jae M.; Reid, Jonathan D.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Multilayered circuit board
What is claimed is: 1. In a multilayered circuit board including at least two layered subassemblies each including at least one dielectric layer having opposing surfaces, electrically conductive wirin... Read More
Inventors: Chen, William T.; Gall, Thomas P.; Wilcox, James R.; Wu, Tien Y.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Plasma processing apparatus and plasma processing method
An object of the present invention is to provide a plasma processing apparatus and a plasma processing method capable of making an electric field in central and edge portions of a substrate to be trea... Read More
Inventors: Kanai, Hideki; Yoneda, Ikuo; Itoh, Masamitsu;, Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP) |
IC Package with heat sink and minimal cross-sectional area
These and other objects are accomplished in accordance with the invention by an IC package that includes a semiconductor chip, a heat sink, a plurality of C-shaped leads, and a solid encapsulating mas... Read More
Inventors: Ritchie, Ronald J.; Andrews, Daniel M.;, Assignee: Burroughs Corporation (Detroit, MI) |
Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles
What is claimed is: 1. A semiconductor device comprising: a plurality of pellets fixed on a bed by means of a conductive adhesive agent, an insulating substrate having a junction wiring, fixed on said... Read More
Inventors: Yanagida, Satoru; Araki, Kouji; Okunoyama, Hikaru; Niimi, Tetsunori;, Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP) |
High-frequency high-power transistor
FIGS. 1(a) and 1(b) are plan and cross-sectional views, respectively, of a conventional high-frequency high-power transistor including a plurality of transistor cells. In FIGS. 1(a) and (b), the tran... Read More
Inventors: Kagawa, Kazuhisa;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Surface mounting module for an electric circuit board
The object of the present invention is therefore to provide an imaging device which solves these problems. The present invention has been developed with a view to substantially solving the above descr... Read More
Inventors: Tsukamoto, Masahide; Nakatani, Seiichi; Ishida, Toru;, Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP) |
Flip chip silicone pressure sensitive conductive adhesive
In a first embodiment, our invention relates to a tacky conductive adhesive that can be repeatedly utilized to test the integrated circuit of any die (chip) prior to its further processing. The tacky ... Read More
Inventors: Bearinger, Clayton R.; Camilletti, Robert C.; Kilby, Jack S.; Haluska, Loren A.; Michael, Keith W.;, Assignee: Dow Corning Corporation (Midland, MI) |
Interface adapter board having arrays of interstitial connectors and an intermediate switching circuit
The present invention provides an interface adapter board that can be inserted directly between two electronic parts without substantially displacing the electronic parts laterally. The interface adap... Read More
Inventors: Chun, Collier S.C.; Skoric, Tom M.;, Assignee: Intel Corporation (Santa Clara, CA) |
Plasma monitoring and control method and system
Therefore, a need has arisen for an improved method and system for monitoring and controlling the generation of plasma in electronic device plasma processing. A need exists for a method and system for... Read More
Inventors: Turner, Terry R.; Spain, James D.; Swyers, John R.;, Assignee: Fourth State Technology, Inc. (Austin, TX) |
Methods and arrangements for determining an endpoint for an in-situ local interconnect etching process
The methods and arrangements of the present invention provide real-time feedback as to the progress of the local interconnect etching processes using optical emission methods and monitoring arrangemen... Read More
Inventors: En, William G.; Holbrook, Allison; Wang, Fei;, Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA) |
In-situ method for measuring the endpoint of a resist recess etch process
We claim: 1. An in-situ method for measuring the endpoint of a resist recess etch process for DRAM trench cell capacitors of ground rules of about 0.175 .mu.m and smaller to determine the buried plate... Read More
Inventors: Jaiprakash, Venkatachalam C.; Mantz, Ulrich;, Assignee: Infineon Technologies AG (Munich, DE) |
Method and apparatus for optical lifetime tracking of trench features
In one aspect of the present invention, a method is provided for performing process lifetime tracking of trench features. A plurality of process steps is performed on a first set of semiconductor wafe... Read More
Inventors: Lensing, Kevin R.;, Assignee: Advanced Micro Devices, Inc. (Austin, TX) |
Streak detection in papermaking
OF PREFERRED EMBODIMENT The papermaking control system illustrated in FIG. 1 can control various parameters of the paper such as moisture, basis weight or caliper and this occurs on various slices or... Read More
Inventors: Wells, Charles H.;, Assignee: Voith Paper Automation, Inc. (Los Gatos, CA) |
Plastic valve assembly
In accordance with the present invention, there is provided a valve assembly that includes a valve body of plastic material. The valve body has a conduit portion and an annular portion extending upwar... Read More
Inventors: Schmitt, Edward L.; Caroleo, Steven J.; Bolam, Charles W.; Conley, Richard W.;, Assignee: Kerotest Manufacturing Corp. (Pittsburgh, PA) |
Electrically actuated valve assembly
The present invention provides an electrically energized pilot operated solenoid valve suitable for very low power direct current voltage controlled systems such as solid state electronic switching fo... Read More
Inventors: Swanson, Wesley S.;, Assignee: Eaton Corporation (Cleveland, OH) |
Electrically operated valve assembly
The present invention provides a unique construction for a solenoid operated appliance water valve. The invention is particularly applicable for such a valve of the type actuated by an electromagnetic... Read More
Inventors: Pick, James M.; Swanson, Wesley S.; Hurst, Edward D.;, Assignee: Eaton Corporation (Cleveland, OH) |
Ventless transfer valve and method for using same
It is a primary objective of this invention to provide an improved a ventless transfer valve and to describe a method for using this valve in the transfer of liquid chlorine from a supply cylinder to ... Read More
Inventors: Powell, Johathan S.;, Assignee: |
Device for a fuel system of an internal combustion engine
What is claimed is: 1. A device for a fuel system of an internal combustion engine, comprising a basic body (30) a stub (45) in said basic body, a pressure chamber (44) that surrounds said stub (45) p... Read More
Inventors: Gerhard, Albert; Strohl, Willi; Rose, Jochen; Eiler, Erich;, Assignee: Robert Bosch GmbH (Stuttgart, DE) |
Pilot mechanism for pressure regulating valve
These and other disadvantages of the prior art are overcome with the present invention which provides a pilot mechanism for a pressure regulating valves having a relatively high pressure inlet, a rela... Read More
Inventors: Scull, William L.;, Assignee: Leslie Co. (Parsippany, NJ) |
Pressure responsive pilot valve
Referring to FIG. 1, a complete pressure relief system 12 is illustrated. This comprises a pressure relief valve 14 and a pilot valve 16. The valve 14 has a passage 18 adapted for connection to a sys... Read More
Inventors: Friend, Ronald G.;, Assignee: Crosby Valve & Gage Company (Wrentham, MA) |
Pilot operated relief valve
The pressure operated relief valve disclosed here employs mechanically independent first and second pressure operated stages. In a typical embodiment, the two-stage pilot valve operates a substantiall... Read More
Inventors: Reip, Raymond G.;, Assignee: Vapor Corporation (Chicago, IL) |
Control Computers 
