Small pipe flowmeter
I claim: 1. An assembly for interposing an ultrasonic flowmeter apparatus in a small diameter pipeline comprising: a. a housing having first and second halves including first and second opposite ends ... Read More
Inventors: Hendriks, Henry L.;, Assignee: Envirotech Corporation (Menlo Park, CA) |
Reduced noise water valve provided with flow control
The primary purpose of this invention is to reduce flow noise in water valves. Another object is to provide controlled flow with high inlet pressures and without valve flutter. To achieve these ends I... Read More
Inventors: Ostrowski, E. A.;, Assignee: The Singer Company (Stamford, CT) |
Single-side connected transducer
Accordingly, it is a general purpose of the present invention to provide structure capable of effecting heat-sensitive piezoelectric substrate transducers which can be adhesively attached to an operat... Read More
Inventors: Scott, William R.;, Assignee: The United States of America as represented by the Secretary of the Navy (Washington, DC) |
Pilot operated valve assembly
The present invention overcomes the above referenced problems and others yet provides a pilot operated valve assembly which is inexpensive to manufacture yet highly reliable. In accordance with the fi... Read More
Inventors: Zukausky, Keith E.;, Assignee: Eaton Corporation (Cleveland, OH) |
Orange juice dispensing system
OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the attached drawing wherein the FIGURE shows a dispensing system 10 wherein juice concentrate and... Read More
Inventors: Kirschner, Jonathan; Smazik, Kenneth G.; Paisley, Gary V.;, Assignee: The Coca-Cola Company (Atlanta, GA) |
Quiet water valve
It is an object of the invention to provide a water valve that overcomes one or more of the disadvantages of prior art water valves. It is a further object to provide the above object in a water valve... Read More
Inventors: Richmond, James W.;, Assignee: Emerson Electric Co. (St. Louis, MO) |
Flow modulating control valve assembly
OF THE PREFERRED EMBODIMENTS Referring to the drawings and particularly FIG. 1, a mixing valve assembly 10 is illustrated generally adapted to mix cold water from a cold water inlet 11 with hot water... Read More
Inventors: Kolze, Lawrence A.;, Assignee: Kolze, Inc. (Seneca, SC) |
Actuating lever
It is an object of the invention to provide an actuating lever for use in a variety of environments where it is desirable that an apparatus to perform one function be started slightly before the start... Read More
Inventors: Jones, Christopher R.;, Assignee: Templex, Inc. (Thomasville, NC) |
Demountable structure
The present invention aims to alleviate at least one of the above disadvantages and to provide a sun shade which will be reliable and effective in use. With the foregoing in view this invention in one... Read More
Inventors: Koehn, Ekkehard;, Assignee: |
Parasol
OF EMBODIMENTS The parasol or sunshade has an awning 1, which in per se known manner has a plurality of awning bars 3, 3' extending radially outwards from a parasol top or cap 2 and which are held in... Read More
Inventors: Steiner, Walter;, Assignee: |
Hanging sun umbrella
What is claimed is: 1. A hanging sun umbrella comprising: a column; an umbrella frame attached to the column, wherein the umbrella frame includes: a hanging arm hingedly attached to the column, a hang... Read More
Inventors: Xu, Zhen Miao;, Assignee: |
Free-arm shade
The task of this invention is to develop the design of such a free-arm shade further so that the taut shade can also be pivoted around the longitudinal axis of the side arm, and, furthermore, so that ... Read More
Inventors: Steiner, Walter;, Assignee: |
Washing container for a dishwashing machine
We claim: 1. A washing container for a dishwashing machine, comprising a plurality of separate parts connected to one another, said parts including a frame having corner regions and at least one remov... Read More
Inventors: Jerg, Helmut; Rosenbauer, Michael; Schessl, Bernd;, Assignee: BSH Bosch und Siemens Hausgeraete GmbH (Munich, DE) |
Lawn and garden feeding apparatus
What is claimed is: 1. A lawn and garden feeding apparatus for use with a source of water and with water discharge means, said feeding apparatus comprising a container having a water inlet opening and... Read More
Inventors: Knapp, Philip B.;, Assignee: |
Check valve
FIG. 1 or FIGS. 3 A and 3 B shows one basic embodiment of the present invention which consists of a circular valve body 1, a circular valve support 2 and a disc valve 3. The valve body 1 defines a pa... Read More
Inventors: Kajita, Yoshio;, Assignee: |
Tilting disc check valve
The present invention contemplates a tilting disc check valve having a replaceable valve assembly which can be machined at low cost and which can be repaired in the field so that only worn components ... Read More
Inventors: Scaramucci, Domer;, Assignee: |
Coolant corrosiveness indicator
The present invention provides a rather inexpensive fluid condition sensor which will provide a visual indication to the user that the heat exchanging fluid has reached a certain corrosive state. Gene... Read More
Inventors: Argyle, Charles S.; Cheadle, Brian E.; Bokor, Steven L. M.;, Assignee: Long Manufacturing Limited (Oakville, CA) |
Relief valve
OF THE PRESENT INVENTION With reference first to FIG. 1, the relief valve 10 according to the present invention is thereshown and comprises a fluid fitting or reducing bushing 12 having an axial thro... Read More
Inventors: Rosaen, Borje O.; Fosdick, Dale P.;, Assignee: |
Multilayer circuit board unit
It is an object of the present invention to provide a small, lightweight multilayer circuit board unit which can be manufactured easily. In order to achieve the above object, according to the present ... Read More
Inventors: Noda, Yuji;, Assignee: NEC Corporation (Tokyo, JP) |
Wired base plate and package for electronic parts
According to an aspect of the present invention, there is provided a novel and improved wired base plate for an electronic part which comprises a substrate, a plural wire layer portion disposed on the... Read More
Inventors: Imai, Ryuji;, Assignee: NGK Spark Plug Co., Ltd. (Nagoya, JP) |
Method of constructing stacked packages
OF THE INVENTION FIG. 1 illustrates a first stacked assembly 100 of the present invention. The stacked assembly 100 comprises a base substrate 102 having a first surface 104 with a plurality of bond ... Read More
Inventors: Akram, Salman; Brooks, Jerry M.;, Assignee: Micron Technology, Inc. (Boise, ID) |
Stacked semiconductor device
The present invention relates to a stacked semiconductor device which can transfer heat generated by the operating semiconductor chip to the other semiconductor chip and the module substrate, or can d... Read More
Inventors: Yoshida, Yuichi;, Assignee: NEC Corporation (Tokyo, JP) |
Mounting component with leads having polymeric strips
The present invention addresses these needs. One aspect of the present invention provides a semiconductor chip mounting component. A component according to this aspect of the invention includes a supp... Read More
Inventors: DiStefano, Thomas H.; Grube, Gary W.; Khandros, Igor Y.; Mathiew, Gaetan;, Assignee: Tessera, Inc. (San Jose, CA) |
Configurable multi-chip module interconnect
As shown by the configurable multi-chip module (MCM) 10 of FIG. 1, typically four levels of metal are required to achieve optimum surface density in an MCM. The top metal layer or bond pad layer 12 p... Read More
Inventors: Sienski, Kenneth T.;, Assignee: E-Systems, Inc. (Dallas, TX) |
Method to optimize the wiring of multiple wiring media packages
It is therefore an object of the present invention to provide a methodology for wiring optimization where there are multiple wiring media having very different wiring geometries and electrical propert... Read More
Inventors: Honsinger, Philip S.; Lim, Lucy; Narayanan, Vinod;, Assignee: International Business Machines Corporation (Armonk, NY) |
General purpose assembly programmable multi-chip package substrate
The present invention is directed to an interconnection substrate for multi-chip modules which is standardized and more easily and inexpensively programmed than prior art interconnection substrates. ... Read More
Inventors: Shihadeh, Elias E.; Weiler, Peter M.;, Assignee: National Semiconductor Corp. (Santa Clara, CA) |
Semiconductor integrated circuit devices adapted for automatic design and method of arranging such devices
An object of the present invention is to reduce area of occupation of circuits formed in accordance with the circuit cell method. Another object of the present invention is to provide a semiconductor ... Read More
Inventors: Hidaka, Hideto;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Methods and apparatuses for binning partially completed integrated circuits based upon test results
Conventional mask-programmed gate array or sea of gates integrated circuits suffer from the limitation that a customer will receive and must accept all devices which fall within the extremes of the pe... Read More
Inventors: Osann, Jr., Robert; Eltoukhy, Shafy;, Assignee: Lightspeed Semiconductor Corporation (Sunnyvale, CA) |
Multi-layer printed circuit board and method of making same
What is claimed is: 1. A printed circuit board having at least two conductor layers and adapted for reduced interfacial shear stresses, comprising: a laminate substrate having: a top layer forming a f... Read More
Inventors: Dailey, Daniel Phillip; Belke, Jr., Robert Edward; Baker, Jay DeAvis; Achari, Achyuta; Lemecha, Myron; Todd, Michael George;, Assignee: Visteon Global Technologies, Inc. (Dearborn, MI) |
Compliant pin for solderless termination to a printed wiring board
In contradistinction to the aforementioned pins, the subject pin is compliant throughout the majority of its length in that it is provided with two or more slots which define two or more spring member... Read More
Inventors: Kirkman, Michael;, Assignee: Augat Inc. (Mansfield, MA) |
Control Computers 
