Wooden identification blocks
In the invention, each block of a set of wooden blocks bears indicia of the tree species of the wood from which the block is made. In preferred embodiments, the blocks are configured as building block... Read More
Inventors: Boundy, Henriette E.; Boundy, Bruce K.;, Assignee: |
Carrier and test socket for leadless integrated circuit
What is claimed is: 1. A leadless integrated circuit carrier and test socket comprising a base, a circuit receiving cavity disposed in a central portion of said base, a plurality of electrically condu... Read More
Inventors: Luthi, Robert B.; Williams, Clair E.;, Assignee: Siliconix, Incorporated (Santa Clara, CA) |
IC package connector
OF A PREFERRED EMBODIMENT A detailed description of a preferred embodiment according to the present invention is now made with reference to FIGS. 1, 2, 3 and 4. As shown in FIG. 1, the connector 6 co... Read More
Inventors: Lai, Vincent; Hsu, J. J.;, Assignee: Foxconn International, Inc. (Sunnyvale, CA) |
Production of semiconductor devices
We claim: 1. A method of electrically interconnecting conductors formed by first and second metal layers respectively on opposing faces of a polyimide substrate by a third electrically conductive laye... Read More
Inventors: Bingham, Kenneth Charles Arthur; Gillingham, Alan George Albert; Baldwin, Colin;, Assignee: International Computers Limited (London, GB2) |
Method of manufacturing a card having electronic memory and a card obtained by performing said method
In order to achieve this aim, the invention makes the electronic module by means of the lead frame technique instead of the printed circuit technique. The present invention provides a method of making... Read More
Inventors: Rebjock, Alain;, Assignee: Schlumberger Industries (Montrouge, FR) |
Retractable caster assembly
Therefore, the objective of the present invention is to provide a retractable caster assembly which can be operated conveniently and which obviates the need for removing a caster unit and replacing th... Read More
Inventors: Jang, Shis-Wen;, Assignee: |
Method for equipping a wiring backplane
It is an object of the present invention to provide a method for equipping a wiring backplane with contact blades wherein the assembly aid for the contact blades, that is, the centering strip, can be ... Read More
Inventors: Zell, Karl; Seidel, Peter;, Assignee: Siemens Aktiengesellschaft (Munich, DE) |
Circuit arrangement for multilayer printed circuit board
Therefore, an object of the present invention is to provide a circuit arrangement for a multilayer printed circuit board on which a plurality of electronic devices are mounted, wherein formation of an... Read More
Inventors: Moriizumi, Kiyokazu; Nishihara, Mikio;, Assignee: Fujitsu Limited (Kawasaki, JP) |
Laminated electronic package including a power/ground assembly
According to the present invention, a power/ground structure and associated circuit card or board and method of manufacturing the same are provided. The card or board is formed of organic electrically... Read More
Inventors: Kresge, John S.; Light, David N.; Wu, Tien Y.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Multi-layer circuit substrate having orthogonal grid ground and power planes
The present invention was made in view of the above-mentioned problems, and an object of the invention is to provide a multi-layer circuit substrate which, by uniformizing the characteristic impedance... Read More
Inventors: Tanahashi, Shigeo;, Assignee: Kyocera Corporation (Kyoto, JP) |
Multichip module and method of forming same
The present invention provides an interconnection medium wherein the number of interconnect layers is reduced while the low inductance power distribution characteristics of parallel power and ground p... Read More
Inventors: Schaper, Leonard W.;, Assignee: The Board of Trustees of the University of Arkansas (Little Rock, AR) |
Multilayer circuit board
The present invention relates to a multilayer circuit board for mounting thereon an electronic part such as a semiconductor chip or device having a large number of electrodes, for example as many as 4... Read More
Inventors: Horiuchi, Michio; Kurihara, Takashi;, Assignee: Shinko Electric Industries Co., Ltd (Nagano, JP) |
Radio frequency filter feedthrough structure for multilayer circuit boards
Briefly, according to the invention, a multilayer circuit board provides a feedthrough filter, by using the different layers of the circuit board to form a filter. The filter is designed by using the ... Read More
Inventors: Higgins, Jr., Robert J.;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Laminate wiring board
It is therefore an object of the present invention to provide a laminate wiring board needing a minimum number of layers. It is another object of the present invention to provide a laminate wiring boa... Read More
Inventors: Tanaka, Shinji;, Assignee: NEC Corporation (Tokyo, JP) |
Electronic component assembly and method for low cost EMI and capacitive coupling elimination
The present invention is directed to an electronic component assembly which can be effectively implemented and which effectively eliminates capacitive coupling while providing significant heat transpo... Read More
Inventors: Schreffler, Gary J.;, Assignee: Lockheed martin Corporation (Bethesda, MD) |
Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board.
What is claimed is: 1. A structure characterized by the provision of: a first conductor layer and a second conductor layer; a third conductor layer provided between said first conductor layer and said... Read More
Inventors: Akiba, Yutaka; Narizuka, Yasunori; Tanei, Hirayoshi; Kitamura, Naoya;, Assignee: Hitachi, Ltd. (Tokyo, JP) |
Electrical connector having enhanced strain relief for signal-sensitive electronic equipment
An electrical connector having enhanced strain relief for signal-sensitive electronic equipment is described. In this context, signal-sensitivity refers to the equipment's tolerance to signal interru... Read More
Inventors: Badinski, Curt Von; Edwards, William; Kornprobst, Michael; Erickson, Bradley; Vasavda, Samir;, Assignee: Cisco Technology, Inc. (San Jose, CA) |
Circuit substrate having ceramic multilayer structure containing chip-like electronic components
Accordingly, an object of the present invention is to provide a ceramic multilayer substrate which can solve the aforementioned problems. Provided according to the present invention is a circuit subst... Read More
Inventors: Takagi, Horshi; Mori, Yoshiaki; Sakabe, Yukio;, Assignee: Murata Manufacturing Co., Ltd. (JP) |
Technique for reducing the number of layers in a multilayer circuit board
According to the present invention, a technique for reducing the number of layers in a multilayer circuit board is provided. The multilayer circuit board has a plurality of electrically conductive sig... Read More
Inventors: Kwong, Herman; Marcanti, Larry E.;, Assignee: Nortel Networks Limited (Montreal) |
Method for producing printed wiring board
It is therefore an object of the present invention to provide a manufacturing method for a printed wiring board whereby a printed wiring board having electronic components enclosed therein can be manu... Read More
Inventors: Nabemoto, Yoshie; Komatsu, Nobuo;, Assignee: Sony Corporation (Tokyo, JP) |
Method for partially exposing conductive strips of flat laminated cable
It is therefore the object of the invention to develop a process and an apparatus for producing windows in exactly predetermined parts above/below individual/all flat conductors of a multiconductor la... Read More
Inventors: Zeibig, Dietmar; hler, Leo;, Assignee: Schleuniger Holding AG (Thun, CH) |
Moulded electrical connector and method for manufacturing same
The above-described problems have been solved by the present invention molded electrical connector and method of manufacturing it. The molded electrical connector comprises: a molding section in which... Read More
Inventors: Urushibata, Kenichi; Kojima, Keiichi; Sugawara, Kiyoto; Matsuda, Tatsuo; Saen, Haruo; Yumoto, Tetsuo; Yoshizawa, Norio; Kanno, Tooru;, Assignee: Sankyo Kasei Co., Ltd. (Tokyo, JP); Sumitomo Electric Industries, Ltd. (Osaka, JP) |
Insulating-material bodies having metal particles dispersed in the resin
We claim: 1. In a process for the formation of a resin containing insulating body containing reduced metal particles which body can be electrolessly coated with a metal, the insulating body being prod... Read More
Inventors: Huthwelker, Dirk; Franz, Arnold; Kopnick, Siegfried;, Assignee: Dynamit Nobel AG (Troisdorf, DE) |
Tab tape, method of bonding tab tape and tab tape package
Accordingly, it is an object of this invention to provide a TAB tape technique for preventing a chip from being lifted up by adhesion of the bonding tool with the leads in the bonding of the TAB leads... Read More
Inventors: Yonehara, Katsuyuki;, Assignee: IBM Corporation (Armonk, NY) |
Conductive coatings and inks
I claim: 1. An electrically conductive composite in a form suitable for applying to the surface of a substrate, said composite comprising a polymeric binder into which carbon fibrils in an amount not ... Read More
Inventors: Friend, Stephen O.;, Assignee: Hyperion Catalysis International (Lexington, MA) |
Selectable chip carrier
OF THE PREFERRED EMBODIMENTS Referring now to the drawings and more particularly to FIGS. 1-3, there is shown a selectable chip carrier 11 having a ceramic or Alumina substrate structure 13 soldered ... Read More
Inventors: Spangler, James B.; Rector, Steve G.;, Assignee: McDonnell Douglas Corporation (Long Beach, CA) |
Mounting structure for an integrated circuit
In view of the aforementioned problems of the prior art, an object of the present invention is to provide a mounting structure for an integrated circuit device which improves electrical characteristic... Read More
Inventors: Tanaka, Shinji;, Assignee: NEC Corporation (Tokyo, JP) |
Read head having a tunnel junction sensor with a free layer biased by exchange coupling with insulating antiferromagnetic (AFM) layers
The present invention overcomes the aforementioned problems by longitudinally biasing first and second side portions of the free layer which extend laterally beyond the track width of the sensor. The ... Read More
Inventors: Ho, Kuok San; Pan, Tao;, Assignee: International Business Machines Corporation (Armonk, NY) |
Multilayer printed circuit board rework method and rework pin
To overcome the problems in the prior art, an improved high performance multilayer printed circuit board assembly has been developed, wherein plated-through holes, arranged in a grid array are structu... Read More
Inventors: Currie, Thomas P.;, Assignee: Unisys Corporation (Blue Bell, PA) |
Method for printed circuit board repair
It is an object of the present invention to rework or repair a printed circuit board efficiently and at minimum cost. Accordingly, method and apparatus for efficiently repairing or reworking a printed... Read More
Inventors: Crudo, Alan Harris; Davis, John Gillette; Le Coz, Christian Robert; Pierson, Mark Vincent; Sarkhel, Amit Kumar; Trivedi, Ajit Kumar;, Assignee: International Business Machines Corporation (Armonk, NY) |
Control Computers 
