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Device for welding a wire by means of thermo-compression bonding
| Details |
Inventors: Schmidt, Jean; Brehon, Pierre;
Assignee: U.S. Philips Corporation (New York, NY)
Primary Examiner: Reynolds; Bruce A.
Assistant Examiner:
Attorney, Agent or Firm: Trifari; Frank R., Treacy; David R.
A device for connecting a wire to a support, for example a semiconductor device, by means of thermocompression bonding, by buttwelding, has a movable tool for holding the wire while one end is exposed. An electrode is spaced from the wire end and means are provided for producing a high electric voltage between the electrode and the wire end so as to produce a spark discharge therebetween sufficient to melt the wire end and form a ball. The tool is then used to cause thermocompression bonding. |
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DETAILED DESCRIPTION What is claimed is: 1. A device for securing a wire to a support element by thermocompression bonding comprising a base for supporting said element, a movably mounted tool for holding said wire so that one end thereof is exposed means for welding said wire to said element by thermocompression bonding, means for supplying wire to said tool and welding means, an electrode located in proximity to the exposed end of said wire, means connected to said electrode and said wire for producing high electric voltage pulses therebetween so as to cause an electric spark discharge between said electrode and said exposed end of said wire sufficient to cause melting thereof thereby forming a ball thereat, means for moving said tool so that said exposed end of said wire having said ball will be in contact with said support element, and means for activating said welding means to weld said wire to said support. 2. The device according to claim 1 wherein said means for producing electric voltage pulses is a pulse generator. 3. The device according to claim 2 further comprising means for placing a notch in said wire after said wire is welded to said support element at approximately the height of said weld, and a movable clamp for clamping said wire and for exerting a pulling force thereon so as to break said wire at said notch, said clamp being electrically conductive so that said pulse generator may be connected to said wire through said clamp.
Description:
The invention relates to a device of connecting a wire to a support, for example a semiconductor device, by means of thermocompression bonding, connection is effected by buttwelding a wire which has a ball at a free end. The ball is formed by the localized melting of the wire. Such a method is particularly suitable for connecting connection conductors, which serve to connect certain regions of a semiconductor body of an electronic device, to other elements of said device. In such a case the end of the wire which comprises the ball is generally butt-welded by means of thermocompression bonding on one of the regions of the semiconductor body, the other end of the connection wire being also welded by means of thermocompression bonding but against the side of the wire, for example, on a connection lug of the device
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