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 Resistor composition and its use

Details
Inventors: Burckhardt, Hans-Georg; Gora, Frieder; Guldner, Karl-Heinz; Dehoust, Jurgen; Modes, Christina; Schmidt, Joachim; Kiemel, Rainer; Kemmler-Sack, Sybille;
Assignee: W. C. Heraeus GmbH (Hanau, DE)
Primary Examiner: Skaling; Linda
Assistant Examiner:
Attorney, Agent or Firm: Felfe & Lynch

Resistor composition to produce thick film resistors, preferably the resistor films in sensors for temperature measurement, includes glass frit and an oxide which is at least one of CaCu.sub.3 Ru.sub.4 O.sub.12 and LaCu.sub.3 Ru.sub.4 O.sub.12.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT The following examples explain in further detail the manufacture of resistor compositions present as resistor pastes in accordance with the invention and of resistor films from these pastes.
The thickness of the dried films d [.
mu.
m], the sheet resistance R.
sub.
f [.
OMEGA.
/.
quadrature.
], and the temperature coefficient of resistance in the range of +25.
degree.
C.
to +125.
degree.
C.
, HTCR [ppm/K] ("Hot Temperature Coefficient of Resistance") of the resistor films obtained by firing the pastes onto aluminum oxide substrates are given.
Example 1 A mixture of 22.
2 wt.
-% CaCu.
sub.
3 Ru.
sub.
4 O.
sub.
12 and 77.
8 wt.
-% of a glass frit of 62 wt.
-% PbO, 29 wt.
-% SiO.
sub.
2, 6 wt.
-% Al.
sub.
2 O.
sub.
3 and 3 wt.
-% CdO having an average particle size of 3-6 micrometer and a 5% solution of ethyl cellulose in terpineol are mixed on a roll mill in a 3 to 1 ratio until a paste is formed.
The paste is printed through a screen of stainless steel {200 mesh}onto Al.
sub.
2 O.
sub.
3 -substrates of 50.
times.
50.
times.
0.
63 mm in dimension.
For 10 minutes it is dried in air at 150.
degree.
C.
and then fired in a belt furnace at a peak temperature of 850.
degree.
C.
for about 10 minutes with a total firing cycle of about 1 hour.
The thickness of the dried films, the sheet resistance referred to a thickness of the dried films of 25 micrometers and the temperature coefficient of resistance of the so produced resistor films are provided in the table.
Example 2 A mixture of 22.
2 wt.
-% LaCu.
sub.
3 Ru.
sub.
4 O.
sub.
12 and 77.
8 wt.
-% of a glass frit of 62 wt.
-% PbO, 29 wt.
-% SiO.
sub.
2, 6 wt.
-% Al.
sub.
2 O.
sub.
3 and 3 wt.
-% CdO having an average particle size of 3-6 micrometer and a 5% solution of ethyl cellulose in terpineol are mixed on a roll mill in a ratio of 3:1 until a paste is formed.
The paste is printed through a stainless steel screen {200 mesh}onto Al.
sub.
3 O.
sub.
3 substrates of 50.
times.
50.
times.
0.
63 mm in dimension.
For 10 minutes it is dried in air at 150.
degree.
C.
and then fired for 10 minutes in a belt furnace at a peak temperature of 850



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