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Home Fault Detection Non-volatile-RAM-cell-with-enhanced-conduction-insulators

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Details
Inventors: Bertin, Claude L.; Kotecha, Harish N.; Wiedman, Francis W.;
Assignee: International Business Machines Corporation (Armonk, NY)
Primary Examiner: Hecker; Stuart N.
Assistant Examiner:
Attorney, Agent or Firm: Limanek; Stephen J.

This invention provides improved non-volatile semiconductor memories which include a volatile circuit coupled to a non-volatile device having a floating gate and first and second control gates capacitively coupled to the floating gate with a charge injector structure disposed between the floating gate and one of the two control gates. The volatile circuit may be a dynamic one-device cell or a static cell such as a conventional flip-flop or latch cell.

DETAILED DESCRIPTION What is claimed is: 1.
A memory system comprising; a semiconductor substrate, a volatile memory cell having a data node formed in said substrate, a non-volatile device including: a floating gate capacitively coupled to said substrate, a first control gate, a thin insulating layer disposed between said floating gate and said first control gate, a second control gate, and a dual charge injector structure disposed between said floating gate and said second control gate, means for coupling one of said control gates of said non-volatile device to said data node, and means for applying control pulses to the other of said control gates of said non-volatile device for selectively transferring data between said data node and said floating gate.
2.
A memory system as set forth in claim 1 wherein said dual charge injector structure is a dual electron injector structure.
3.
A memory system as set forth in claim 1 wherein said charge injector structure has a capacitance substantially smaller than the capacitance formed by said first control gate, said insulating layer and said floating gate.
4.
A memory system as set forth in claim 3 wherein said charge injector structure is an electron injector structure having at least one layer of silicon-rich silicon dioxide.
5.
A memory system as set forth in claim 4 wherein said electron injector structure is a dual electron injector structure having two layers of silicon-rich silicon dioxide separated by a layer of substantially impurity-free silicon dioxide.
6.
A memory system as set forth in claim 1 wherein said memory cell includes an input/output transistor and said floating gate is disposed between said input/output transistor and said data node.
7.
A memory system as set forth in claim 1 wherein said memory cell includes a voltage source terminal and said floating gate is disposed between said terminal and said data node.
8.
A memory system as set forth in claim 7 wherein said memory cell includes a load resistor disposed between said terminal and said floating gate



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