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Semiconductor integrated circuit boundary scan test with multiplexed node selection
| Details |
Inventors: Imai, Kiyoshi; Tsuji, Toshiaki; Takada, Taku; Taguchi, Seiichi;
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka, JP)
Primary Examiner: Williams; Howard L.
Assistant Examiner:
Attorney, Agent or Firm: Willian Brinks Olds Hofer Gilson & Lione
A semiconductor integrated circuit having a test circuit built therein is disclosed which consists of an A/D converter to be connected to a peripheral circuit, a digital circuit connected to the A/D converter, a digital signal switching device for selectively connecting to the output of the A/D converter and that of the digital circuit, and a boundary scan output circuit connected to the output of the digital signal switching device, wherein the digital signal switching device connects the A/D converter to the boundary scan output circuit in a normal mode, while the signal fetched in the boundary scan output circuit is outputted therefrom in test mode. Semiconductor integrated circuits having an analog circuit built therein and an analog integrated circuit in which a test circuit is built-in are also disclosed. |
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DETAILED DESCRIPTION The object of the present invention is therefore to provide a semiconductor integrated circuit having a test circuit built therein to facilitate the board test of massproduced printed circuit boards having both analog and digital circuits thereon.
In order to achieve the object, the present invention provides a semiconductor integrated circuit comprising a digital circuit and an A/D converter, in which the inputs of digital signal switching devices are outputs of the A/D converter and digital circuit, and boundary scan output circuits are connected to the outputs of the digital signal switching devices.
According to another aspect of the present invention, a semiconductor integrated circuit is provided, which comprises an analog circuit, an A/D converter and a digital circuit, wherein the inputs of an analog signal switching device are outputs of an analog signal input terminal and analog circuit, the inputs of digital signal switching devices are outputs of the A/D converter and digital circuit, and boundary scan output circuits are connected to the outputs of the digital signal switching devices.
The A/D converter is connected to an output of the analog signal switching device, and the digital circuit is connected to outputs of the A/D converter.
According to a yet further aspect of the present invention, a semiconductor integrated circuit is provided, which comprises an analog circuit alone, wherein an analog signal switching device has inputs from analog signal input terminals, an A/D converter is connected to an output of the analog signal switching device, and boundary scan output circuits are connected to the outputs of the A/D converter.
In the aforementioned structure, in a semiconductor integrated circuit comprising a digital circuit and an A/D converter, outputs from the A/D converter are set directly to the boundary scan output circuits by the digital signal switching devices, so that the improper connection of an analog circuit in the periphery of the A/D converter mounted outside the semiconductor integrated circuit is inspected
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Fault Detection 
