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 Aluminum nitride sintered body having conductive metallized layer

Details
Inventors: Horiguchi, Akihiro; Kasori, Mituo; Ueno, Fumio; Sato, Hideki; Mizunoya, Nobuyuki; Endo, Mitsuyoshi; Tanaka, Shun-ichiro; Shinozaki, Kazuo;
Assignee: Kabushiki Kaisha Toshiba (Kawasaki, JP)
Primary Examiner: Kittle; John E.
Assistant Examiner:
Attorney, Agent or Firm: Foley & Lardner, Schwartz, Jeffery, Schwaab, Mack, Blumenthal & Evans

For higher thermal conductivity, stronger adhesion strength, excellent insulating characteristics, and multilayer interconnection, an aluminium sintered body for circuit substrates comprises a novel conductive metallized layer on the surface of the sintered body. The metallized layer comprises at least one element selected from the first group of Mo, W and Ta and at least one element selected from the second group of IIa, III, IVa group elements, lanthanide elements, and actinide elements in the periodic table, as the conductive phase element. The first group element serves to improve the heat conductivity and resistance, while the second group serves to increase the wetness and adhesion strength between the insulating body and the metallized layer. Further, the plural insulating ceramic bodies and the plural metallized conductive layers can be sintered simultaneously being stacked one above the other to permit a multilayer interconnection.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the aluminium nitride sintered body according to the present invention for providing a stronger adhesion strength comprises a conductive metallized layer on at least a part of an insulating layer of AlN sintered body, the conductive metallized layer including: (a) at least one element selected from the first group consisting of molybdenum, tungsten and tantalum; and (b) at least one element selected from the second group consisting of IIa group elements, IIIa and IIIb group elements, IVb group elements, rare-earth elements, and actinide elements in periodic law table, as the conductive phase composing component elements.
As described above, the AlN sintered body according to the present invention is characterized by the combination of component elements for composing the phase of the conductive metallized layer formed on the sintered body base material (corresponding to the insulating layer) surface, so that the properties of the AlN sintered body base material itself are not particularly limited.
In the component elements of the conductive metallized layer, the elements belonging to the first group of molybdenum (Mo), tungsten (W) and tantalum (Ta) are excellent in heat resistance and further approximate to the AlN sintered body base material in thermal expansion coefficient, so that these elements serve to improve the heat resistance characteristics and the cyclic heat resistance characteristics.
These elements are included in a filler of the metallized layer as a single element or a combination of two or more elements.
In more detail, these elements belonging to the first group exist in the metallized layer in the form of each element, a compound or solid solution including each element, or a mixture of two or more elements selected from the group consisting of these elements, compounds and solid solutions.
The compounds are oxides of these elements, nitrides thereof, carbides thereof, acid nitrides thereof, carbonic nitrides thereof, carbonic oxides thereof, carbonic acid nitrides thereof, borides thereof, silicides thereof, etc



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