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Fuel Cells

Contact-structure-and-production-method-thereof-and-probe-contact-assembly-using-same

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Contact structure and production method thereof and probe contact assembly using same

Details

Inventors: Zhou, Yu; Yu, David; Aldaz, Robert Edward; Khoury, Theodore A.;
Assignee: Advantest Corp. (Tokyo, JP)
Primary Examiner: Nguyen; Khiem
Assistant Examiner:
Attorney, Agent or Firm: Muramatsu & Associates

A contact structure for establishing electrical connection with contact targets has a unique mounting mechanism for easy assembly. The contact structure is formed of a contactor carrier and a plurality of contactors. The contactor carrier includes a sliding layer for locking the contactors on the contactor carrier. The contactor has an upper end having a cut-out to engage with the sliding layer, a lower end oriented in a direction opposite to the upper end and functions as a contact point for electrical connection with a contact target, and a diagonal beam portion provided between the upper end and the lower end to function as a spring.

DETAILED DESCRIPTION Therefore, it is an object of the present invention to provide a contact structure having a large number of contactors for electrically contacting with contact targets with a high frequency bandwidth, high pin counts and high contact performance as well as high reliability.
It is another object of the present invention to provide a contact structure such as a probe card for use in testing semiconductor devices and the like which has a very high frequency bandwidth to meet the test requirements in the next generation semiconductor test technology.
It is a further object of the present invention to provide a contact structure having a large number of contactors where the contactors and the contactor carrier can be assembled easily by using a lock mechanism incorporating a sliding layer.
It is a further object of the present invention to provide a contact structure to establish electrical connection with a large number of semiconductor devices for testing such semiconductor devices in parallel at the same time.
It is a further object of the present invention to provide a method for producing a large number of contactors in a two dimensional manner on a silicon substrate, removing the contactors from the substrate and mounting the contactors on a contact substrate in a three dimensional manner to form a contact structure.
In the present invention, a contact structure is formed of a large number of contactors produced on a planar surface of a dielectric substrate such as a silicon substrate by a photolithography technology.
The contact structure of the present invention is advantageously applied to testing and burning-in semiconductor devices, such as LSI and VLSI chips, semiconductor wafers and dice, packaged ICs, printed circuit boards and the like.
The contact structure of the present invention can also be used as components of electronics devices such as IC leads and pins.
The first aspect of the present invention is a contact structure for establishing electrical connection with contact targets

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