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Foamed polymer semiconductor composition and a method of producing thereof
| Details |
Inventors: Topchiashvili, Mikhail Izmailovich; Datsko, Taisia Fedorovna; Kikvilashvili, Givi Mikhailovich; Maisuradze, Ledi Alexeevna;
Assignee:
Primary Examiner: Lovering; Richard D.
Assistant Examiner: Parr; E. Suzanne
Attorney, Agent or Firm: Haseltine, Lake & Waters
A foamed polymer semiconductor composition, characterized in that it has the following formulation, in weight parts: PRETEXTREPLACED After mixing the above-mentioned components self-foaming of the composition takes place and then its hardening follows. The composition has electric specific resistance in the range of 10 to 10.sup.12 ohm.cm. The present composition will find wide application in civil and hydraulic engineering for plugging up cracks in concrete and reinforced concrete structures. |
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DETAILED DESCRIPTION We claim: 1. A foamed polymer semiconductor composition having a formulation, in weight parts:
epoxy resin 100
electrically conductive black
or graphite 10-60
polyethylhydridesiloxane 0. 1-50
polyethylenepolyamine 10-25
organic solvent 0-50
2. A method of producing a foamed polymer semiconductor composition according to claim 1 comprising mixing 100 parts by weight of epoxy resin and, optionally, 0 to 50 parts by weight of an organic solvent for said epoxy resin with 10 to 60 parts by weight of electrically conductive black or graphite and agitating the mixture until a homogeneous mass is obtained, adding to the mixture 0. 1 through 50 parts by weight of polyethylhydridesiloxane and 10 through 25 parts by weight of polyethylenepolyamine, agitating the mixture until a homogeneous distribution of the polyethylhydridesiloxane and polyethylenepolyamine in the mixture is obtained and allowing said mixture to foam and subsequently harden to form said foamed polymer semiconductor composition.
Description:
The present invention relates to electrically conductive polymer materials and more particularly to foamed polymer semiconductor compositions and methods of their production. The above-mentioned composition may be employed in various engineering fields, for example, in rocketry and aircraft engineering as a heat-insulating material, as a material to remove static electricity and that to absorb radiowaves. Moreover, it may be used in civil and hydraulic engineering for plugging up cracks in concrete and reinforced concrete structures. Known in the art is a foamed polymer semiconductor composition based on epoxy resin, which includes electrically conductive black and a hardener, viz. polyethylenepolyamine. A disadvantage of such a composition lies in the fact it has insufficient heat resistance and is produced by the method requiring additional expenses to carry out, foaming of the components. The method of producing the above-mentioned composition consists in blending epoxy resin with electrically conductive black and polyethylenepolyamine; the resulting mixture being foamed by a gas introduced into it, for example, by some inert gas
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