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Gold-plated electronic components
| Details |
Inventors: Nagashima, Teruyoshi; Takami, Akio; Kasugai, Akiyo;
Assignee: NGK Spark Plug Co., Ltd. (Aichi, JP)
Primary Examiner: Kaplan; G. L.
Assistant Examiner: Leader; W. T.
Attorney, Agent or Firm: Sughrue, Mion, Zinn, Macpeak and Seas
Gold-plated electronic components are disclosed, as well as a process for producing the same, wherein an alloy of nickel and cobalt or an alloy containing these elements as essential ingredients is used as an undercoat for the gold-plated layer. |
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DETAILED DESCRIPTION OF THE INVENTION The present invention is concerned with electronic components having a gold-plated layer on a metal surface.
There is no particular restriction on the metal surface to which the gold-plated layer can be formed by the present invention.
Examples of the metal surface are metals which constitute ordinary electronic components such as copper, iron, and aluminum, and ceramic substrates whose surfaces are metallized with materials composed mainly of tungsten, molybdenum, or mixtures thereof.
Gold-plated electronic equipment includes, for example, circuit boards for hybrid IC, IC package boards, LSI packages, boards for LED, microswitches, small switches, and connector plugs.
Gold is used for a variety of purposes including the wire bonding, tip attachment and soldering (including sealing) of electronic component parts, the provision of conductors and contacts, and also for rust-proofing of these parts.
The present invention is applicable to all of these applications.
The present invention is characterized by applying a plated layer of an alloy of nickel and cobalt or an alloy containing these metals as essential ingredients as an undercoat for the gold-plated layer in these electronic components.
The method of applying the alloy plating is not limited.
It is formed in a thickness of about 0.
1 to 10 microns, preferably about 0.
5 to 5 microns, by electroplating, electroless plating, etc.
The preferred content of cobalt in the alloy is from about 2 to 60% by weight, and especially from about 7 to 40% by weight.
In most cases the balance of the alloy is nickel.
If the cobalt content is less than 2 by weight, the heat resistance and connecting property of the resulting alloy coating are not improved appreciably.
On the other hand, if the cobalt content exceeds 55% by weight, solderability becomes inferior, and moreover, this is economically disadvantageous because cobalt is much higher in price than nickel.
In electroless plating, when sodium hypophosphite is used as reducing agent, the alloy will be 2 to 60% cobalt, 88 to 30% nickel and the remainder, about 10% phosphorus
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