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Joined ceramic-metal composite substrate and method for production thereof
| Details |
Inventors: Mizunoya, Nobuyuki; Komorita, Hiroshi; Tanaka, Tadashi; Matsumura, Kazuo;
Assignee: Kabushiki Kaisha Toshiba (Kanagawa, JP)
Primary Examiner: Ryan; Patrick
Assistant Examiner:
Attorney, Agent or Firm: Finnegan, Henderson, Farabow, Garrett, and Dunner
A joined ceramic-metal composite substrate having a copper sheet directly joined to a ceramic substrate and a method for the production thereof. The composite substrate is characterized by having at least one through hole in the copper sheet which is connected to at least one groove formed at a distance from the edge of the copper sheet on the surface of the copper sheet to be joined to the ceramic substrate. |
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DETAILED DESCRIPTION This invention has been produced for the solution of the above problems.
An object of this invention is to provide a joined ceramic-metal composite substrate which can be produced in high yield without the occurrence of blisters in the interface.
Another object of this invention is to provide a joined ceramic-metal composite substrate enjoying highly satisfactory thermal conductivity and enabling subsequent treatments such as the mounting of a chip thereon to be carried out without any noteworthy trouble.
To be more specific, this invention is directed to a joined ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly joined to one of the surfaces of the ceramic substrate, at least one hole through the copper sheet, and at least one groove on the face of the copper sheet, the face including an area surrounding the face free from the grooves.
The method for producing the ceramic circuit substrate according to this invention comprises, the steps of disposing a prescribed shaped copper circuit board having many grooves formed in its one side to have its grooved side contacted with the ceramic substrate, and bonding the substrate and the board by heat treating.
The copper circuit board used for the ceramic circuit substrate according to this invention is formed with many grooves at a prescribed distance from each edge in each copper sheet, in other words excluding a prescribed width from each edge, and at least one through hole to which each groove is connected is formed in the copper sheet.
Thus, forming the grooves as above can prevent the etching liquid and liquid material such as soldering flux from entering into the grooves in the mounting process, if the through hole is covered by resin.
This is because such a through hole or the copper sheet can be covered easily and steadily.
Forming the grooves as above can also prevent the composite substrate from having blisters in the interface.
This is because the gas entrapped in the interface can be taken away through such grooves connected to the through hole
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