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| Process for treating selected areas of a surface with solder |
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Long wafer waferboard panels
| Details |
Inventors: Barnes, Derek;
Assignee: MacMillan Bloedel Limited (Vancouver, CA)
Primary Examiner:
Assistant Examiner:
Attorney, Agent or Firm:
A waferboard panel is made from long wafers to have the same strength properties as plywood. The panel comprises at least three layers of wood wafers having an initial aggregate specific gravity, less than about 0.6 oven dry weight with volume at 12% moisture content, the panel having face layers on outside surfaces and at least one core layer. The wafers in the face layers have a mean orientation not greater than about 10.degree., and lengths of at least about 6 inches, preferably 12 inches. Average widths of the wafers in the face layers are in the range of about 0.3 to 2.0 inches and the panel has an oven dry wood density in the range of about 28 to 45 lbs. per cu. ft. with an MOR to density ratio of at least about 120 and an MOE (M) to density ratio of at least about 40. |
|
DETAILED DESCRIPTION The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows.
1.
A waferboard panel with increased strength properties comprising at least three layers of wood wafers, having an initial aggregate specific gravity less than about 0.
6 oven dry weight with volume at 12% moisture content, the panel having face layers on outside surfaces and at least one core layer, the wafers in the face layers having a mean orientation in the range of about 2.
degree.
to 10.
degree.
, the wafers in the face layers having lengths of at least about 6 inches, average widths in the range of about 0.
3 to 2.
0 inches, and average thickness in the range of about 0.
01 to 0.
05 inches, the panel having an oven dry wood density in the range of about 28-45 lbs.
per cu.
ft.
with, an MOR to density ratio of at least about 120 and an MOE(M) to density ratio of at least about 40.
2.
The waferboard panel according to claim 1 having a phenol formaldehyde resin content in the range of about 11/2 to 8% based on the oven dry weight of the wood wafers for the face layers and core layers.
3.
The waferboard panel according to claim 2 having a phenol formaldehyde resin content in the range of about 2 to 3% based on the oven dry weight of the wood wafers for the face layers and core layers.
4.
The waferboard panel according to claim 1 wherein the average thickness of the wafers in the face layers is in the range of about 0.
020 to 0.
030 inches, and the average thickness of the wafers in the core layers is in the range of about 0.
030 to 0.
050 inches.
5.
The waferboard panel according to claim 1 wherein the wafers in the face layers have lengths of at least about 12 inches.
6.
The waferboard panel according to claim 1 wherein each layer of wood wafers has a thickness greater than three wafers.
7.
A waferboard panel with increased strength properties comprising at least three layers of wood wafers having an initial aggregate specific gravity less than about 0.
6, oven dry weight with volume at 12% moisture content, the panel having face layers on outside surfaces and at least one core layer, the wafers in the face layers having a mean orientation in the range of about 2 to 10 degrees, the face layers having wafers with lengths of at least about 6 inches, average widths in the range of about 0
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