Loose parts plating device

DETAILED DESCRIPTION The present invention provides a straightforward economical means for electroplating selected areas of small metallic articles.
Further, devices within the scope of the present invention provide means to rapidly and efficiently electroplate only selected areas of metallic articles, including where desired inside areas of tubular devices, without waste of the electroplating solution or overplating.
Heretofore, prior art methods and apparatus have been directed to electroplating the outside of articles, such as electrical contacts.
My co-pending application above referred to illustrates one effective means to plate the inside surface of tubular articles, as sometimes utilized in the electronics industry without plating virtually the entire article.
The present invention provides another apparatus and method for effectively plating the internal and external contact areas of electrical connectors.
More particularly, the present invention provides a method and apparatus for continuous electroplating of selected portions of elongate metallic articles including a moving conveyor with spaced apertures therein to receive the articles so the portion of articles to be electroplated extending downwardly from the conveyor whereby the portion to be electroplated is passed through cell means containing electroplating solution as the conveyor moves and the articles contact the solution in the cells where a direct current circuit is connected through the parts to the solution.