Method for fabricating a field emission device having black matrix SOG as an interlevel dielectric

DETAILED DESCRIPTION One technique for improving the reliability of the anode plate by eliminating the use of the externally attached ribbon is to design the anode plate using Double Level Metal (DLM) techniques.
FIG.
5 is a top view of an arrangement of the conductive stripes and buses of the anode plate using double level metal techniques.
As shown in FIG.
5, all red anode stripes 50.
sub.
R are electrically interconnected to the red color bus 52, all green anode stripes 50.
sub.
G are electrically interconnected to the green color bus 54, and all blue anode stripes 50.
sub.
B are electrically interconnected to the blue color bus 56.
The anode plate of the present invention is designed such that the conductors 50 do not extend beyond their respective buses.
The purpose of this design is to minimize the number of regions in the anode plate DLM bus structure where a bus of one color must cross an anode stripe of another color.
For example, red bus 52 does not cross any green or blue anode stripes 50.
sub.
G or 50.
sub.
B, and green bus 54 only crosses the red anode stripes 50.
sub.
R.
In each cross-over region a bus metal (for example 54) crosses an anode stripe 50 which is connected to a different bus (for example 50.
sub.
R) and the two metal layers are separated only by an insulator layer.
If a defect exists in the insulator layer, then a bus of one color will electrically short to an anode stripe of another color.
When a bus of a first color shorts to an anode stripe of a second color then color distortion occurs as the phosphors of the second material are energized and therefore illuminate during the time that the phosphors of the first color are illuminated.
Using the structure shown in FIG.
5 for the FED anode plate design, the anode stripes 50 would be typically 80 microns wide.
Since the application requires 80 microns wide anode stripes, the layout engineer would typically make the width of the buses 52, 54, and 56 approximately 80 microns wide also.
This bus width would be chosen because it would be easy to design and because it easily accommodates the current and voltage drop requirements of the anode plate design