Phase shifiting mask and method of manufacturing the same

DETAILED DESCRIPTION Accordingly, the present invention is directed to a phase shifting mask and a method of manufacturing the same that substantially obviates one or more of the problems due to limitations and disadvantages of the related art.
An object of the present invention is to provide a phase shifting mask with an improved adhesion between a light-shading layer and a phase shifting layer to prevent a physical or a mechanical separation of the two layers.
Another object of the present invention is to provide a method of manufacturing a phase shifting mask in which a light-shading layer is formed to a uniform thickness and the surface planarity of a phase shifting layer is raised, thereby improving the phase shifting effect.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the invention.
The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, a phase shifting mask of the present invention includes a transparent substrate, a groove formed to a predetermined depth on the transparent substrate, a light-shading layer formed within the groove to shade an incident light, and a phase shifting layer formed such that a predetermined part is in contact with the light-shading layer and the other part is in contact with the transparent substrate, thereby shifting the phase of the incident light.
In another aspect, a method of manufacturing a phase shifting mask of the present invention includes the steps of forming a sacrificial layer on a predetermined region of a transparent substrate and forming sidewalls on the sides of the sacrificial layer; anisotropically etching the transparent substrate by using the sacrificial layer and the sidewalls as a mask, to thereby form a groove; removing the sidewalls; depositing an opaque material which becomes transparent when being oxidized so as to fill the groove on the exposed region of the transparent substrate and oxidizing the opaque material to form a phase shifting layer and simultaneously, to define a light-shading layer within the groove; and removing the sacrificial layer