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| Gas-tight, sealed metal oxide/hydrogen storage battery |
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Process for preparation of a masking element for forming a multicolor printing plate
| Details |
Inventors: Moriya, Takeo; Toshio, Yamagata; Masako, Ogura;
Assignee: Kimoto & Co., Ltd. (Tokyo, JP)
Primary Examiner:
Assistant Examiner:
Attorney, Agent or Firm:
The present invention relates to a photosensitive masking element for plate making including a support made of a transparent film; a metal thin film layer formed on the support; and a photosensitive masking layer formed on said metal thin film layer and strongly adhering thereto. In preparing masks for various colors, the photosensitive masking material of the present invention makes it unnecessary to fill and retouch ditches corresponding to unnecessary enclosing lines with a correction liquid, resulting in a marked improvement in the efficiency of plate making. |
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DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG.
2, the photosensitive mask forming element of the present invention is composed of a support 9 made of a transparent film; a thin metal film layer 10 formed on said support 9; and a photosensitive masking layer 11 formed as a tough film on said metal thin film layer 10 and strongly adhering thereto.
According to the present invention, there can be used as the support 9, a film forming thermoplastic, high molecular weight compound having a smooth surface on which the metal thin film can be provided.
Examples of suitable film-forming thermoplastic high molecular weight compounds are polyester, polycarbonate, polyamide, polypropylene, polyvinyl chloride, polystyrene, polymethyl methacrylate and copolymers thereof as well as diacetyl cellulose, triacetyl cellulose, propyl cellulose and mixed cellulose ester.
Particularly preferred is a biaxially oriented polyethylene terephthalate film having excellent dimensional stability.
As the metal which forms the metal thin film layer 10, there can be used any metal which can form a thin film by means of any of the various film forming techniques.
The thickness of the metal thin film is preferred to be at least 50 m.
mu.
.
If it is less than 50 m.
mu.
, the light shielding effect thereof is insufficient.
The upper limit of the film thickness is 1000 m.
mu.
.
If it exceeds 1000 m.
mu.
, the metal thin film becomes too strong and the resolving power of the image suffers when partially peeled off according to the present invention.
Vacuum plating such as vaporization and sputtering, nonelectrode plating or a combination thereof with electroplating may be used to form the metal film.
The various metals which can be vacuum plated included aluminum, zinc, silver, gold, nickel, cupper, chromium, cobalt, iron and the like.
Further, various alloys can be plated by means of sputtering.
Cupper, nickel, cobalt, gold, palladium, silver, nickel-cobalt alloy can be plated by means of any known nonelectrode plating
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