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Home Gene Therapy Low-stress-conformal-coatings-of-reliability-without-hermeticity-for-microelectromechanical-system-based-multichip-module-encapsulation

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 Low stress conformal coatings of reliability without hermeticity for microelectromechanical system based multichip module encapsulation

Details
Inventors: Wong, Ching Ping; Wu, Jiali;
Assignee: Georgia Tech Research Corp. (Atlanta, GA)
Primary Examiner: Peng; Kuo-Liang
Assistant Examiner:
Attorney, Agent or Firm: Thomas, Kayden, Horstemeyer & Risley LLP, Vorndran; Charles, Deveau; Todd

The present invention provides low stress non-hermetic conformal coatings for the protection of microelectronic devices, such as a Microelectromechanical system (MEMS) based multichip module from adverse environments. The induced stress from these two coatings due to the thermal cycling and manufacture processing will not cause any influence on sensing accuracy of the piezopressure sensor or similar functional MEMS devices. Furthermore, the conformal coatings have the merits of low glass transition temperature, good elongation, low moisture uptake and mobile ion permeation, room temperature curability and good contamination resistance to the jet fume, which promise a high reliability for the aerospace and avionics application. One conformal coating comprises a composition/formulation containing a rubber, siloxane or urethane oligomer modified epoxy and an organic hardener, and optionally an organic diluent and a curing catalyst. Another conformal coating comprises a composition/formulation containing a silicone elastomer or gel and a metal chelate catalyst, and optionally a silica filler, a diluent and an adhesion promoter or coupling agent.

DETAILED DESCRIPTION The present invention overcomes the limitations of existing technology and addresses the needs therein by providing low stress conformal coatings.
In one aspect of the invention, low stress conformal coatings are provided by introducing a flexible, but durable, molecular segment into the polymeric structure, yielding a conformal coating having a low glass transition temperature (Tg), and low storage modulus, preferably lower than about 65 MPa, as well as the intrinsic merits and characteristics of epoxy.
The conformal coatings can have varying amounts of diluent to decrease viscosity and decrease the storage modulus.
Another aspect of the present invention provides a curable epoxy composition for forming a conformal coating, the composition including an elastomer modified epoxy base resin, wherein the base resin in about 44 to about 70 wt % epoxy and from about 20 to 35 wt % elastomer; a diluent, wherein the diluent is about 0 to about 30 wt %; a catalyst; and a hardener.
The epoxy base resin can be modified with elastomers, including but not limited to rubber, silicone, urethane oligomers, carboxylic acid terminated butadiene acrylonitrile (CTBN), polycarboxylic acid terminated butadiene acrylonitrile, epoxide terminated butadiene acryonitrile, siloxane modified epoxy, siloxane modified amine, epoxide polyurethane and mixtures thereof.
Suitable diluents include compounds that decrease viscosity and storage modulus of the cured modified epoxy resin and can include but are not limited to flexible aliphatic epoxide, aliphatic diepoxide, aliphatic multiepoxide, and mixtures thereof.
The diluents can be branched or unbranched.
Suitable catalysts can include tertiary amines, tertiary phosphines, imidazole and its derivatives, imidazolium salts, onium salts and the mixtures thereof.
Suitable hardeners can include low molecular weight and high reactivity liquid acids.
Another aspect of the invention provides a conformal coating formed by reacting an elastomer modified epoxy base resin, wherein the base resin in about 44 to about 70 wt %; a diluent, wherein the diluent is about 0 to about 30 wt %; a catalyst; and a hardener



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