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Heat sink assembly for a central processing unit of a computer
| Details |
Inventors: Wang, Michael;
Assignee: Tennmax Trading Corp. (TW)
Primary Examiner: Thompson; Gregory D.
Assistant Examiner:
Attorney, Agent or Firm: Parkhurst, Wendel & Burr, L.L.P.
A heat sink assembly for a central processing unit (C.P.U.) of a computer consists of a baseplate to which a fan is attached, a plurality of spacers, a corresponding plurality of plates, the spacers and plates each defining a central opening and being alternately stacked on the baseplate and surrounding the fan, thereby defining vents leading to a central passage defined by the central openings, and a cover plate defining a further central opening communicating with the central passage. The base plate, spacers, plates and cover plate are secured to each other by bolts and screws extending through holes defined therein. Clips can be received around the C.P.U., the baseplate and a lowermost plate to removably secure them together. Cool ambient air is drawn into the assembly unit by the fan via the vents, which then passes up the central passage, being warmed by heat originally generated by the C.P.U. to exit via the central opening of the cover plate thereby discharging excess heat from the heat sink assembly. |
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DETAILED DESCRIPTION The present invention provides a heat sink assembly for a computer chip which includes a baseplate with a bottom side secured to a computer chip and a top side to which a fan is removably secured, a combinative heat sink assembly comprising alternating layers of spacers and plates with vents defined therebetween and each spacer and plate further defining a large central opening, the spacers and plates being mounted to the top side of the baseplate surrounding the fan, a cover plate mounted to an uppermost plate and fixing means such as bolts which extend downwardly through the cover plate, the plates and the spacers to threadedly engage with the baseplate, whereby, as the fan rotates, cool, ambient air is drawn into the heat sink assembly via the vents between the spacers and plates and is urged upwardly through a passage defined by large central openings of the spacers and plates to exit via the cover plate and so discharge heat originally generated by the computer chip.
According to a first embodiment of the present invention, the spacers are substantially cross-shaped having a large central opening defined by a ring from which tips of the cross extend, the kips each defining a first through hole, and further having a small tab extending outwardly from the ring between each of two corresponding tips with a first tab hole defined therethrough.
The plates are square and have a large central opening, a second through hole defined near each corner of the square and a second tab hole defined through each of four inwardly facing tabs which are equispaced between the respective second through-holes.
According to a second embodiment of the present invention, two notches are defined in each of two opposite edges of a lowermost square plate whereby four U-shaped clips each with a resilient tongue can be removably mounted over the computer chip, the baseplate and a lowermost cross-shaped spacer to removably retain the heat sink assembly to the computer chip.
According to a third embodiment of the present invention, the cover plate has two spars formed in the large central opening to which the fan can be mounted to an underside thereof
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Generators or Motors 
