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Heat Accumulators

Bipartite-heat-sink-positioning-device-for-computer-chips

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Bipartite heat sink positioning device for computer chips

Details

Inventors: Hung, Chin-Ping;
Assignee:
Primary Examiner: Rivell; John
Assistant Examiner: Leo; L. R.
Attorney, Agent or Firm: Bacon & Thomas

A bipartite heat sink positioning device for computer chips incorporates a two-piece heat sink including a plurality of fins projecting from upper surfaces thereof and generally flat bottom surfaces adapted to engage a computer chip. Each of the sink bodies include inner and outer end portions with the inner end portions terminating in respective upstanding walls and the outer end portions being formed with respective elastic clamping parts. The outer end portions are also each formed with a pair of spaced fixing holes. The heat sink is adapted to be secured to a computer chip by positioning the first and second sink bodies upon the chip with the elastic clamping pans engaging respective opposing side shoulders of the chip and the inner end portions of the sink bodies being slightly spaced. The bipartite heat sink positioning device further includes a fan including a body provided with four tap holes positioned in spaced intervals about an outer peripheral portion of the body of the fan. The fan is adapted to be mounted upon the heat sink by means of a plurality of fasteners adapted to extend through the tap holes of the fan and to be secured within the fixing holes of the heat sink. According to a first embodiment, securing the fasteners causes the inner end portions of the sink bodies to come together thereby causing the clamping pans to firmly grasp the chip. In a second embodiment, a spring is used to bias the sink bodies together.

DETAILED DESCRIPTION The purpose of the present invention is to solve the above-mentioned defects by providing a bipartite heat sink positioning device for computer chips by equally dividing the heat sink into two parts and securing the heat sink to the fan and CPU in an effective manner.
Another purpose of the present invention is to provide a bipartite heat sink positioning device for computer chips, for which the heat sink is divided into two pieces, so the surface processing area is smaller, whereby the difference in flatness is thus reduced and more precise for processing, which will cause the heat sink to closely contact the CPU such that the heat conducting effect can be increased.
One further purpose of the present invention is to provide a bipartite heat sink positioning device for computer chips wherein the assembly of the heat sink and the CPU is performed by securing the two-piece sink bodies on the CPU in such a manner that it will be easy to hold the CPU from each side thereof.
These and other purposes of the present invention are achieved by providing a bipartite heat sink positioning device for computer chips that incorporates a two-piece heat sink bodies having a plurality of fins projecting from upper surfaces thereof and generally flat bottom surfaces adapted to engage a computer chip.
Each of the sink bodies includes inner and outer end portions with the inner end portions terminating in respective upstanding walls and the outer end portions being formed with respective elastic clamping pans.
The outer end portions are also each formed with a pair of spaced fixing holes.
The heat sink is adapted to be secured to a computer chip by positioning the first and second sink bodies upon the chip with the elastic clamping parts engaging respective opposing side shoulders of the chip and the inner end portions of the sink bodies being slightly spaced.
The bipartite heat sink positioning device further includes a fan including a body provided with four tap holes positioned in spaced intervals about an outer peripheral portion of the body of the fan The fan is adapted to be mounted upon the heat sink by means of a plurality of fasteners adapted to extend through the tap holes of the fan and to be secured within the fixing holes of the heat sink

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