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Cooling device for a liquid-cooled semiconductor power component
| Details |
Inventors: Klein, Erwin;
Assignee:
Primary Examiner: Myhre; Charles J.
Assistant Examiner: Richter; Sheldon
Attorney, Agent or Firm: Lerner; Herbert L.
Cooling device for a liquid-cooled semiconductor power component of the type having a disc cell formed with two main contact surfaces and electrical and thermal pressure-contacting means therefor in an insulating casing, and having means for liquid cooling including cooling capsules through which liquid flows, the cooling capsules being connected by a clamping device to the two main contact surfaces of the disc cell and being selectively coupable through a liquid-conducting support bar to a plurality of semiconductor power components, including insulating screw connections for connecting union pipes and connecting pipes for the coolant to the cooling capsules with an inclusion of at least partly cold-deformable material of the insulating screw connections, the cooling capsules being connected coolant-wise in series, and including expansion bends formed at least in the connecting pipes between the cooling capsules. |
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DETAILED DESCRIPTION There are claimed: 1.
Cooling device for a liquid-cooled semiconductor power component of the type having a disc cell formed with two main contact surfaces and electrical and thermal pressure-contacting means therefor in an insulating casing, and having means for liquid cooling including cooling capsules through which liquid flows, the cooling capsules being connected by a clamping device to the two main contact surfaces of the disc cell so as to have the electrical potential thereof and being selectively couplable through a liquid-conducting support bar to a plurality of semiconductor power components, comprising insulating screw connections for connecting union pipes and connecting pipes for the coolant electrically insulatingly to the cooling capsules with an inclusion of at least partly cold-deformable material of said insulating screw connections, the cooling capsules being connected mutually and to a cooling source coolant-wise in series and having doubly stepped-down connecting nozzles, one of the steps thereof having a greater diameter than that of the other step and being formed with an external thread, a transition surface formed on said connecting nozzles between said steps thereof and having a greater diameter than the diameters of both of said steps, respectively, said transition surface being a stop for the pipe connected to the respective connecting nozzle, and said other step forming a support ring for the pipe, and a screw cap matched to the shape of the respective connecting nozzle disposed on the pipe and, in tightened condition on the connecting nozzle, holding a cold-deformed portion of the end of the pipe between the other step of the respective connecting nozzle and a corresponding recess formed in said screw-cap, and including expansion bends formed at least in the connecting pipes between the cooling capsules.
Description:
The invention relates to a cooling device for a liquid-cooled semiconductor power component of the type having a disc cell formed with two main contact surfaces and electrical and thermal pressure contacting means therefor in an insulating casing, and having means for liquid cooling including cooling capsules through which liquid flows, the cooling capsules being connected by a clamping device to the two main contact surfaces of the disc cell and being selectively couplable through a liquid-conducting support bar
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Heat Accumulators 
