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Process for preparation of metal vessels
| Details |
Inventors: Ishibashi, Kazuhisa; Kurashima, Hideo; Yasumuro, Hisakazu; Watanabe, Michio; Imatani, Tsuneo; Taira, Kazuo; Kobayashi, Seishichi; Ueno, Hiroshi;
Assignee: Toyo Seikan Kaisha, Ltd. (Tokyo, JP)
Primary Examiner: Gilden; Leon
Assistant Examiner:
Attorney, Agent or Firm: Sherman & Shalloway
Disclosed is a process for the preparation of metal vessels, which comprises lap-bonding both the circumferential end portions of upper and lower members, each consisting of a seamless formed metal cup, through a layer of a hot adhesive interposed therebetween, wherein a high frequency induction heating coil is arranged so that the coil covers a part, smaller than the semicircle, of the circumferential portion to be formed into a seam, which circumferential portion consists of said end portions engaged with each other through the hot adhesive layer, electricity is applied to the heating coil to induce an eddy current passing through said end portions and the circumferential portion and the heating coil are rotated relatively to each other, whereby both the end portions are heated and a seam is formed by heat bonding. |
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DETAILED DESCRIPTION It is therefore a primary object of the present invention to provide a process in which in preparing a metal vessel having a circumferential lap seam, both the end portions of upper and lower members engaged with each other through an adhesive resin layer are simultaneously and effectively heated from either the end portion on the outer side or the end portion on the inner side by high frequency induction heating.
Another object of the present invention is to provide a process in which a hot adhesive interposed between both the engaged end portions for forming a circumferential seam is heated effectively and uniformly in a short time by high frequency induction heating.
Still another object of the present invention is to provide a process in which both the end portions of upper and lower members, between which an adhesive layer is interposed, are heated at optional temperatures, respectively.
More specifically, in accordance with the present invention, there is provided a process for the preparation of metal vessels, which comprises lap-bonding both the circumferential end portions of upper and lower members, each consisting of a seamless formed metal cup, through a layer of a hot adhesive interposed therebetween, wherein a high frequency induction heating coil is arranged so that the coil covers a part, smaller than the semicircle, of the circumferential portion to be formed into a seam, which circumferential portion consists of said end portions engaged with each other through the hot adhesive layer, electricity is applied to the heating coil to induce an eddy current passing through said end portions and the circumferential portion and the heating coil are rotated relatively to each other, whereby both the end portions are heated and a seam is formed by heat bonding.
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