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Heat Accumulators

Tinned-copper-braids-for-solder-removing

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Tinned copper braids for solder removing

Details

Inventors: Spirig, Ernst;
Assignee:
Primary Examiner: Lanham; C. W.
Assistant Examiner: Ramsey; K. J.
Attorney, Agent or Firm: Cushman, Darby & Cushman

A device for removing a solder alloy from a solid soldered joint comprising a multiplicity of metallic strands formed into an elongated wick operable to effect the solder removal through the application of an end portion thereof to the joint in heat exchange relation to a heat source so that when the solder alloy is rendered molten by the heat source it will flow by capillary action from the joint into the applied end portion of the wick, the improved step of each metallic strand of the wick having its exterior surface coated with solidified solder alloy having a melting point substantially below the melting point of tin prior to being formed into the wick so that when the end portion thereof is applied to the joint in heat exchange relation with the heat source as aforesaid the solid solder alloy of the coating on the strands of the applied end portion when rendered molten by the heat source mixes with the molten solder alloy from the joint flowing by capillary action into the applied end portion of the wick, and an improved wick formed by the method.

DETAILED DESCRIPTION I claim: 1.
A device for removing a solder alloy from a solid soldered joint comprising a multiplicity of metallic strands formed into an elongated wick operable to effect said solder removal through the application of an end portion thereof to the joint in heat exchange relation to a heat source so that when the solder alloy is rendered molten by the heat source it will flow by capillary action from the joint into the applied end portion of the wick, the improvement which comprises each metallic strand of said wick having its exterior surface coated with solidified solder alloy having a melting point substantially below the melting point of tin prior to being formed into said wick so that when the end portion thereof is applied to said joint in heat exchange relation with the heat source as aforesaid the solid solder alloy of the coating on the strands of the applied end portion when rendered molten by the heat source mixes with the molten solder alloy from the joint flowing by capillary action into the applied end portion of the wick.
2.
The improvement as defined in claim 1 wherein said solidified solder alloy coating has a melting point below 400.
degree.
F.
3.
The improvement as defined in claim 1 wherein said solidified solder alloy coating has a melting point below 370.
degree.
F.
4.
The improvement as defined in claim 1 wherein said solder alloy coating is a solder alloy of approximately 60% tin and 40% lead.
5.
A method of forming a multiplicity of metal strands into an elongated wick capable of removing solder alloy from a solid soldered joint through the application of an end portion of the wick to the joint in heat exchange relation to a heat source so that when the solder alloy is rendered molten by the heat source it will flow by capillary action from the joint into the applied end portion of the wick, the improvement which comprises the step of coating the metallic strands of said wick with solidified solder alloy having a melting point substantially below the melting point of tin prior to the formation of said metallic strands into said wick so that when the end portion thereof is applied to the joint in heat exchange relation with the heat source as aforesaid the solid solder alloy of the coating on the strands of the applied end portion when rendered molten by the heat source mixes with the molten solder alloy from the joint flowing by capillary action into the applied end portion of the wick

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