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| Machine control system |
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| Transmitting commands over a serial link |
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| Microprocessor with pipeline system having exception processing features |
| In the light of the above problems, the present invention has been designed. A first object of this ... |
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| Controller for a cross-point switching matrix |
| Accordingly, it is an object of this invention to provide an electronic controller for a cross-... |
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| Method for manufacturing a custom-circuit LSI, and a gate array device |
| The object of the present invention is to provide a method for manufacturing a large-scale custom-... |
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| Semicustom made integrated circuit equipped with controller for input/output buffers |
| It is therefore an important object of the present invention to provide a semicustom made ... |
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Card type semiconductor device
| Details |
Inventors: Hashimoto, Nobuaki; Nakamura, Norio; Suemori, Hiroyuki; Sugai, Hiroshi; Imaoka, Norio; Noake, Kazuyoshi;
Assignee: Seiko Epson Corporation (Tokyo, JP)
Primary Examiner: Whitehead; Carl W.
Assistant Examiner:
Attorney, Agent or Firm: Oliff & Berridge, PLC
A card type semiconductor device includes a main circuit board and a first sub-circuit-board equipped with a main memory. The main circuit board is connected to the first sub-circuit-board through an FPC. A first TCP equipped with the CPU and a second TCP equipped with the I/O sub-system chip are mounted on the top and bottom surfaces of the main circuit board. The first and second TCPs are mounted to directly oppose each other. The card type semiconductor device is used as a card type computer. The main circuit board and the sub-circuit-board face each other by bending the FPC and enclosing the main circuit board and the sub-circuit-board in a card-shaped thin housing. The card type semiconductor device achieves a high density packaging in a small form factor. The card type semiconductor device supports high speed operations and provides a structure for adaptation to new applications quickly and inexpensively by allowing easy replacement of the sub-circuit-board with other sub-circuit boards that perform a wide range of functions. |
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DETAILED DESCRIPTION The invention solves the above problems of the conventional devices and methods discussed above.
Accordingly, an object of the invention is to provide a card type semiconductor device which easily and quickly adapts to different functional requirements and operating conditions and to easily change memory capacity.
Thus, the flexibility and versatility of the card type semiconductor device is ensured and the cost reduced.
In addition, the size and thickness of a print circuit board is reduced to form an entire device in a compact unit.
When thermosetting protective resin, used to protect IC chips, is applied to a circuit board on which bare IC-chips are connected at a high density, a deformation such as a warp may appear in the circuit board after the protective resin sets.
The invention provides a card type semiconductor device that has a structure which resist this deformation.
A further object of the invention is to provide a card type semiconductor device that has a strong and durable structure so that the card type semiconductor device is both compact and durable meeting field handling requirements.
The high-density packaging, the reduction in size of patterns formed on the circuit board, and the reduction in the power consumption expose the card type semiconductor device to the influences of both externally and internally generated noises.
Analog circuit portions such as a floppy disk drive unit, an analog-to-digital (AD) converter and a phase-locked loop (PLL) may become unstable when noise is induced into the lines by the digital circuit portions.
Thus, still another object of the invention is to provide a card type semiconductor device which decreases susceptibility to electrical noise.
This provides stable reliable operation, especially for analog circuit portions.
Yet another object of the invention is to provide a flexible and adaptable method for manufacturing the card type semiconductor device which are tailored to special purposes without significantly changing the manufacturing process, thus reducing the manufacturing costs
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I/O Systems 
